DLPA078B February   2017  – September 2021 DLP160AP , DLP160CP , DLP2000 , DLP2010 , DLP230GP , DLP230KP , DLP230NP , DLP3010 , DLP3310 , DLP4710 , DLP471TP , DLPC3420 , DLPC3421

 

  1.   Trademarks
  2. 1 Introduction to Optical Modules
    1. 1.1 DLP Pico Chip or Digital Micromirror Device (DMD)
    2. 1.2 Illumination
    3. 1.3 llumination Optics
    4. 1.4 Projection Optics
    5. 1.5 Flash Memory Board
  3. 2 Use Case Considerations
    1. 2.1 Optical Module Specifications
  4. 3 Core Optical Module Specifications
    1. 3.1 Brightness
    2. 3.2 Size
    3. 3.3 Resolution
    4. 3.4 Illumination Power Consumption
    5. 3.5 Throw Ratio
    6. 3.6 Offset
    7. 3.7 Contrast Ratio
  5. 4 Additional Optical Module Specifications
    1. 4.1 Brightness Uniformity
    2. 4.2 Focus Uniformity
    3. 4.3 Color Management
    4. 4.4 Illumination Type
    5. 4.5 Thermal Management
    6. 4.6 Optical Zoom
    7. 4.7 Depth of Focus
    8. 4.8 Focus Method
    9. 4.9 Automatic White Point Correction
  6. 5 Features Implemented in Software
    1. 5.1 Keystone Correction
    2. 5.2 DLP Image Processing Settings
    3. 5.3 DLP IntelliBright Algorithms
  7. 6 Hardware Integration Considerations
    1. 6.1 Flash Memory
    2. 6.2 DLP Controller to DMD Interface
    3. 6.3 Flash Memory to DLP Controller Interface
  8. 7 Business Considerations
    1. 7.1 Cost
    2. 7.2 Custom Optical Modules
    3. 7.3 Minimum Order Quantity (MOQ)
    4. 7.4 Lead Times
  9. 8 Example Optical Module Specification Table
  10. 9 Get Started with Development
  11. 10Revision History

1.5 Flash Memory Board

The flash memory board is a small board typically attached to either the module itself or the flex cable connecting the DMD and DLP controller. DLP image processing settings specific to the optical module are stored in the flash memory and are used by the DLP controller during configuration of the system.

GUID-55C12EE7-1011-4A35-92BE-E8A700686302-low.gif Figure 1-2 Optical Components in an Example Pico Projection Optical Module Dimensions: 68×57×15 mm3

TI manufactures and sells the DLP chipset, which includes a DMD, a controller IC, and a power management IC (PMIC). Of these three components, only the DMD is included in an optical module (the controller and PMIC are integrated on a nearby printed circuit board or PCB).

TI offers a portfolio of DMDs that enable different classes of optical modules (see the DLP Display & Projection Chipset Selection Guide). Optical modules are designed and manufactured by third party companies (see Figure 1-3). Customers can source a pre-existing, tooled optical module from an optical module manufacturer (OMM) to speed design time and get to market faster. Alternatively, custom optical modules can be designed by an OMM with additional time and resources. The optical module ecosystem is robust, with OMMs worldwide that can supply a variety of optical modules in high volumes.

GUID-DC96EACF-E5B9-4A25-86F9-79A7993F1C6B-low.gif Figure 1-3 Supply Chain from TI DLP Chip to Product