JAJSVS9 December   2024 ESD801-Q1

PRODUCTION DATA  

  1.   1
  2. 1特長
  3. 2アプリケーション
  4. 3概要
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings - AEC Specifications
    3. 5.3 ESD Ratings - IEC Specifications
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Thermal Information
    6. 5.6 Electrical Characteristics
    7. 5.7 Typical Characteristics
  7. 6Device and Documentation Support
    1. 6.1 ドキュメントの更新通知を受け取る方法
    2. 6.2 サポート・リソース
    3. 6.3 Trademarks
    4. 6.4 静電気放電に関する注意事項
    5. 6.5 用語集
  8. 7Revision History
  9. 8Mechanical, Packaging, and Orderable Information

5.5 Thermal Information

THERMAL METRIC(1) ESD801-Q1 UNIT
DPY (DFN1006)
2 PINS
RθJA Junction-to-ambient thermal resistance 262.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 132.3 °C/W
RθJB Junction-to-board thermal resistance 78.5 °C/W
ΨJT Junction-to-top characterization parameter 2.2 °C/W
ΨJB Junction-to-board characterization parameter 78 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance NA °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.