SBVU080 September   2023

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   Applications
  6.   6
  7. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  8. 2Hardware
    1. 2.1 Power Requirements
    2. 2.2 Setup
    3. 2.3 Connector Information
      1. 2.3.1 VIN and GND
      2. 2.3.2 VOUT and GND
    4. 2.4 Jumper Information
      1. 2.4.1 J13 EN
      2. 2.4.2 J16
      3. 2.4.3 J19
      4. 2.4.4 J20
      5. 2.4.5 J22
      6. 2.4.6 J23
      7. 2.4.7 J24
      8. 2.4.8 J27
    5. 2.5 Test Points
      1. 2.5.1 TP1
      2. 2.5.2 TP3
    6. 2.6 TRKRLDOEVM-119 Operation and Component Selection
    7. 2.7 Optional Load Transient Circuit Operation
  9. 3Hardware Design Files
    1. 3.1 Schematic
    2. 3.2 Board Layout
    3. 3.3 Bill of Materials (BOM)
  10. 4Additional Information
    1. 4.1 Trademarks

Board Layout

Figure 4-2 through Figure 4-9 illustrate the board layout for the TRKRLDOEVM-119 PCB.

The TRKRLDOEVM-119 dissipates power, which can cause some components to experience an increase in temperature. The populated tracker LDO and pulsed resistors R11, R12, R13, R14, and R15 are most at risk of raising the junction temperature during normal operation. The LDO can become hot to the touch during normal operation; see the thermal impedance discussion in the populated tracker LDO data sheet.

GUID-20230803-SS0I-6VHD-XQG8-PXPJV2TZL7SQ-low.svgFigure 3-2 Top Assembly Layer and Silkscreen
GUID-20230803-SS0I-LN14-MPG8-P6HRXC1FNMTB-low.svgFigure 3-4 Internal Layer 1
GUID-20230803-SS0I-FL3L-RQSP-XZBCDM1XBTQT-low.svgFigure 3-6 Internal Layer 3
GUID-20230803-SS0I-XR7Z-RQ4R-KPMZXHK41PXN-low.svgFigure 3-8 Bottom Layer Routing
GUID-20230803-SS0I-HCDD-2HJQ-CRF0VTXZWQX6-low.svgFigure 3-3 Top Layer Routing
GUID-20230803-SS0I-BD5T-DLP9-XCM3CKDWWKRN-low.svgFigure 3-5 Internal Layer 2
GUID-8696E629-44B2-4F59-BAA7-3A24343FEA72-low.svgFigure 3-7 Internal Layer 4
GUID-20230803-SS0I-MGP2-70ZM-WVZZCCTWSKPL-low.svgFigure 3-9 Bottom Assembly Layer and Silkscreen