1 Simplifying the Sourcing Strategy

As sourcing strategies have become an increasingly large concern, this dual footprint design method provides an remarkable way to fulfill customer’s multi-source requirement. The design allows for a single vendor, for example, TI, to satisfy the sourcing demands. The design increases the number of orderable parts that can be used for a socket without sacrificing board space. This reduces the out of stock, inventory management issues that can pop up since there is a greater chance that at least one package option is available for purchase. Most TI signal switches and multiplexers are offered in more than one package. Another added benefit is the security of staying ahead of package obsolescence. The semiconductor industry is moving towards smaller footprints which brings the risk of a package being discontinued at some point in the future by a manufacturer. By placing the newest package offering’s footprint in your design, this risk is mitigated.