SFFS134 November   2022 TIOS1023 , TIOS1025

 

  1.   Trademarks
  2. 1Overview
  3. 2Functional Safety Failure In Time (FIT) Rates
  4. 3Failure Mode Distribution (FMD)
  5. 4Pin Failure Mode Analysis (Pin FMA)
  6. 5Revision History

Pin Failure Mode Analysis (Pin FMA)

This section provides a Failure Mode Analysis (FMA) for the pins of the TIOS102(x) device family. The failure modes covered in this document include the typical pin-by-pin failure scenarios:

  • Pin short-circuited to Ground (see Table 4-2)
  • Pin open-circuited (see Table 4-3)
  • Pin short-circuited to an adjacent pin (see Table 4-4)
  • Pin short-circuited to VCC (see Table 4-5)
  • Pin short-circuited to VCC_OUT (for TIOS1023 and TIOS1025, see Table 4-6)
  • Pin short-circuited to VCC_IN (for TIOS102, see Table 4-7)

Table 4-2 through Table 4-7 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.

Table 4-1 TI Classification of Failure Effects
ClassFailure Effects
APotential device damage that affects functionality
BNo device damage, but loss of functionality
CNo device damage, but performance degradation
DNo device damage, no impact to functionality or performance

Figure 4-1 and Figure 4-2 show the pin diagrams for TIOS102(x) family. For a detailed description of the device pins please refer to the 'Pin Configuration and Functions' section in the TIOS102(x) datasheet.

Figure 4-1 Pin Diagram (TIOS102)
Figure 4-2 Pin Diagram (TIOS1023, TIOS1025)

Following are the assumptions of use and the device configuration assumed for the pin FMA in this section:

  • All conditions meet recommended operating conditions

Table 4-2 Pin FMA for Device Pins Short-Circuited to Ground
Pin NamePin No.Description of Potential Failure Effect(s)Failure Effect Class
VCC_OUT (TIOS1023, TIOS1025)1Device I/O logic blocks unpowered. Although LDO current is internally limited to 35 mA ±20%, thermal shutdown may be activated depending upon ambient temperature and the power dissipation in the LDO.

B

VCC_IN (TIOS102)

Device not functional. Logic I/O blocks powered by VCC_IN will be unpowered. No communication with MCU.

B

NFAULT2Incorrect fault indicator output. Microcontroller will assume device is in the fault state for the duration of the short event.B
NC3NoneD
IN4OUT pin will be stuck at high (high-side switch ON) for the duration of the short event if EN is high. Device transmitter is not functional.B
EN5Device Driver is always tri-stated. Device transmitter is not functional.B
ILIM_ADJ6Device operates with the highest current limit setting. Overcurrent fault will not be indicated and the driver will not be disabled due to overcurrent fault.

Thermal shutdown may be triggered.

B

GND7NoneD
OUT8Output stuck at low and no commnunication is possible. When EN=H and IN=LOW, device will go into current fault due to overcurrent condition cycling into driver turn-off and auto-recovery cycles. Thermal shutdown may be triggered.

B

VCC9Device is unpowered and not functional.B
NC10NoneD

Thermal Pad

-

None

D

Table 4-3 Pin FMA for Device Pins Open-Circuited
Pin NamePin No.Description of Potential Failure Effect(s)Failure Effect Class
VCC_OUT

(TIOS1023, TIOS1025)

1Sensor/Microcontroller will not be functional if VCC_OUT is powering the sensor/microcontroller. No communication with MCU.B

VCC_IN (TIOS102)

1

Device will not be functional. Logic I/O blocks powered by VCC_IN will be unpowered. No communication with MCU.

B

NFAULT2No NFAULT information provided to the microcontroller.

B

NC3NoneD
IN4No data can be transmitted from the Sensor/Microcontroller to the outputB
EN5Device driver is always tri-stated due to internal pull-down. Device can only receive dataB
ILIM_ADJ6Device operates with a different current limit setting than intended. Overcurrent fault will be indicated without blanking time and the driver will not be disabled due to overcurrent fault.

B

GND7Device is unpowered.B
OUT8No communication with other devices over the bus.B
VCC9Device is unpowered.B
NC10NoneD

Thermal Pad

-

If thermal pad is not connected to GND planes in the PCB, thermal performance will not be optimal

C

Table 4-4 Pin FMA for Device Pins Short-Circuited to Adjacent Pin
Pin NamePin No.Shorted toDescription of Potential Failure Effect(s)Failure Effect Class
VCC_OUT

(TIOS1023, TIOS1025)

1NFAULTHigh ICC current during internal NFAULT active conditions. No external NFAULT active indicationB

VCC_IN (TIOS102)

High ICC_IN current during internal NFAULT active conditions. No external NFAULT active indication

B

NFAULT2NCNone as long as NC is not connected to anything external to the deviceD
NC3INNone as long as NC is not connected to anything external to the deviceD
IN4ENIf IN and EN are driven to different states communication and device state can be compromisedB
EN5NANoneD
ILIM_ADJ6GNDDevice operates at the maximum current limit. Overcurrent fault will not be indicated and the driver will not be disabled due to overcurrent fault. Thermal shutdown may be triggered.

B

GND7OUTOutput stuck at low and no commnunication is possible. When EN=H and IN=LOW, device will go into current fault due to overcurrent condition cycling into driver turn-off and auto-recovery cycles. Thermal shutdown may be triggered.

B

OUT8VCCNo communication over the bus. Internal reverse polarity protection helps protect the device as long as absolute maximum operating conditions are not exceeded.

B

VCC9NCNone as long as NC is not connected to anything external to the deviceD
NC10NANoneD
Note: The VSON package includes a thermal pad. All device pins are adjacent to the thermal pad. The device behavior when pins are shorted to the thermal pad depends on which net is connected to the thermal pad (recommended connection is GND).
Table 4-5 Pin FMA for Device Pins Short-Circuited to VCC
Pin NamePin No.Description of Potential Failure Effect(s)Failure Effect Class
VCC_OUT/ VCC_IN1ABS Max violation on VCC_OUT pin. Sensor /Microcontroller damaged by VCC_IN/VCC_OUT over-voltage.A
NFAULT2Absolute maximum operating condition exceededA
NC3None as long as NC is not connected to anything external to the deviceD
IN4Absolute maximum operating condition exceededA
EN5Absolute maximum operating condition exceededA
ILIM_ADJ6Absolute maximum operating condition exceededA
GND7Device not functional. Ensure that the absolute maximum ratings are not exceeded otherwise device damage may be plausible

B

OUT8Device not functional. Ensure that the absolute maximum ratings are not exceeded otherwise device damage may be plausible.

B

VCC9NAD
NC10None as long as NC is not connected to anything external to the deviceD
Table 4-6 Pin FMA for Device Pins Short-Circuited to VCC_OUT (TIOS1023, TIOS1025)
Pin Name Pin No. Description of Potential Failure Effect(s) Failure Effect Class
VCC_OUT 1 NA D
NFAULT 2 High current draw from the internal LDO current when the NFAULT is pulled low internal to the device. No fault indication to the microcontroller. B

NC

3

None

D

IN

4 Device transmitter will always output low on the bus. Device transmitter functionality is lost. B
EN 5 Transmitter is always enabled. Receiver will loop back the data on the IN pin B
ILIM_ADJ 6 May cause degradation in the current limiting functionality. C

GND

7 Device I/O logic blocks unpowered . Thermal shutdown may be activated due to excessive current draw from the internal LDO. B

OUT

8 Device not functional. Ensure that the absolute maximum ratings are not exceeded otherwise device damage may be plausible on the VCC_OUT pin B

VCC

9 Absolute maximum operating condition exceeded on VCC_OUT pin A
NC 10

None

D

Table 4-7 Pin FMA for Device Pins Short-Circuited to VCC_IN (TIOS102)
Pin NamePin No.Description of Potential Failure Effect(s)Failure Effect Class
VCC_IN1NAD
NFAULT2High current draw from the external LDO that's supplying VCC_IN when the NFAULT is pulled low internal to the device. No fault indication to the microcontroller.B

NC

3

None.

D

IN

4Device transmitter will always output low on the bus. Device transmitter functionality is lost.B
EN5Transmitter is always enabled. Receiver will loop back the data on the IN pinB
ILIM_ADJ6May cause degradation in the current limiting functionality.C

GND

7Device I/O logic blocks unpowered. High current draw from the external LDO supplying VCC_IN.B

OUT

8Communication is not possible over the bus.B

VCC

9Absolute maximum operating condition exceeded on VCC_IN pin

A

NC10

None

D