SFFS185 June   2021 LMR33620AP-Q1 , LMR33630AP-Q1

 

  1.   Trademarks
  2. 1Overview
  3. 2Failure Mode Distribution (FMD)
  4. 3Functional Safety Failure In Time (FIT) Rates
    1. 3.1 LMR33630AP-Q1
    2. 3.2 LMR33620AP-Q1
  5. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 LMR33630AP-Q1 and LMR33620AP-Q1

3.1 LMR33630AP-Q1

This section provides Functional Safety Failure In Time (FIT) rates for the LMR33630AP-Q1 based on the following two different industry-wide used reliability standards:

  • Table 3-1 provides FIT rates based on IEC TR 62380 / ISO 26262 part 11
  • Table 3-2 provides FIT rates based on the Siemens Norm SN 29500-2

Table 3-1 Component Failure Rates per IEC TR 62380 / ISO 26262 Part 11
FIT IEC TR 62380 / ISO 26262FIT (Failures Per 109 Hours)
Total Component FIT Rate21
Die FIT Rate9
Package FIT Rate12

The failure rate and mission profile information in Table 3-1 comes from the Reliability data handbook IEC TR 62380 / ISO 26262 part 11:

  • Mission Profile: Motor Control from Table 11
  • Power dissipation: 555 mW
  • Climate type: World-wide Table 8
  • Package factor (lambda 3): Table 17b
  • Substrate Material: FR4
  • EOS FIT rate assumed: 0 FIT

Table 3-2 Component Failure Rates per Siemens Norm SN 29500-2
Table Category Reference FIT Rate Reference Virtual TJ
5 CMOS, BICMOS ASICS Analog and Mixed ≤ 50-V supply 25 FIT 55°C

The Reference FIT Rate and Reference Virtual TJ (junction temperature) in Table 3-2 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.