SFFS550 March   2024 OPA2607-Q1 , OPA607-Q1

 

  1.   1
  2.   Trademarks
  3. 1Overview
  4. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 DBV Package
    2. 2.2 DGK Package
  5. 3Failure Mode Distribution (FMD)
  6. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 DBV Package
    2. 4.2 DGK Package

1 Overview

This document contains information for the OPAx607-Q1 (DBV and DGK packages) to aid in a functional safety system design. The DBV package corresponds to the single-channel amplifier, while the DGK package corresponds to the dual-channel amplifier. Information provided are:

  • Functional safety failure in time (FIT) rates of the semiconductor component estimated by the application of industry reliability standards
  • Component failure modes and their distribution (FMD) based on the primary function of the device
  • Pin failure mode analysis (pin FMA)

Figure 1-1 shows the device functional block diagram for reference.

GUID-20210105-CA0I-FGFS-GWCG-1H0XZCVLVL9M-low.gifFigure 1-1 Functional Block Diagram

The OPAx607-Q1 was developed using a quality-managed development process, but was not developed in accordance with the IEC 61508 or ISO 26262 standards.