SLAA381C December   2007  – September 2018 MSP430F233 , MSP430F235 , MSP430F2410 , MSP430F247 , MSP430F248 , MSP430F249

 

  1.   Migrating From MSP430F13x and MSP430F14x MCUs to MSP430F23x and MSP430F24x MCUs
    1.     Trademarks
    2. 1 Comparison of MSP430F1xx and MSP430F2xx Families
    3. 2 Hardware Considerations for F13x/F14x to F23x/F24x Migration
      1. 2.1 Device Package and Pinout
      2. 2.2 Current Consumption
      3. 2.3 Operating Frequency and Supply Voltage
      4. 2.4 Device Errata
    4. 3 Firmware Considerations for F13x/F14x to F23x/F24x Migration
      1. 3.1 Memory Considerations
        1. 3.1.1 Device Memory Map
        2. 3.1.2 Information Flash Memory
      2. 3.2 Serial Communication – USART and USCI
        1. 3.2.1 UART Mode
        2. 3.2.2 SPI Mode
      3. 3.3 Clock System
        1. 3.3.1 LFXT1 and XT2 Oscillators
        2. 3.3.2 Digitally Controlled Oscillator (DCO)
      4. 3.4 Bootloader (BSL)
      5. 3.5 Interrupt Vectors
      6. 3.6 Beware of Reserved Bits!
      7. 3.7 Timers
      8. 3.8 Analog Comparator
    5. 4 References
  2.   Revision History

1 Comparison of MSP430F1xx and MSP430F2xx Families

The MSP430F2xx family of microcontrollers provides an upgrade path for the MSP430F1xx family, offering more performance, lower power, and more built-in features. This enables an improved and more cost-optimized system design. Table 1 is a general high-level comparison of the two device families and provides an overview of reasons why you should consider migrating to the MSP430F2xx family.

Table 1. Comparison of F1xx and F2xx Families

Feature F1xx MCUs F2xx MCUs
Maximum CPU clock speed 8 MHz 16 MHz
Wake up from LPM3/LPM4 <6 µs <1 µs
Standby current consumption (LPM3) <2 µA <1 µA
Brown-out reset Selected devices only All devices
Minimum voltage for flash ISP 2.7 V 2.2 V
Integrated port pullup or pulldown resistors – On all ports
Internal oscillator (DCO) Large voltage and temperature drift (±20%) Very small voltage and temperature drift (±2%),
Factory calibrated
Oscillator fault detection High-frequency crystal High-frequency and low-frequency crystal
Additional built-in low-power low-frequency oscillator – 12-kHz VLO
Additional oscillator features – Minimum pulse clock filter for increased system robustness,
Configurable built-in crystal load capacitors
Additional watchdog timer features – Invalid address detection,
Fail-safe clock source
Bootloader (BSL) Protected through 256-bit password Hack proof
Flash memory configurations Up to 60 KB Up to 120 KB (as of 4Q07)
RAM Up to 10 KB Up to 8 KB (as of 4Q07)
Operating temperature (TA) –40°C to 85°C –40°C to 105°C

While the F23x/F24x MCUs can be considered as a direct pin-to-pin compatible drop-in to existing F13x/F14x designs, there are some important details that require attention. This application report helps to identify potential issues. After migration, the application benefits from all the MSP430F2xx family enhancements as indicated in Table 1. These enhancements might enable further cost savings or other system-level optimizations. This document focuses on transitioning existing designs and leaves it to the engineer to make use of additional MSP430F2xx features during migration as applicable for a given system (for example, the use of internal pullup or pulldown resistors, making changes to the clock configuration, and so on).