SLUAB09 October   2025 AMC0386-Q1 , TPS61170 , TPS61170-Q1 , TPSI2140-Q1

 

  1.   1
  2.   Abstract
  3. 1Introduction
    1. 1.1 Background
    2. 1.2 System Requirements
    3. 1.3 Typical Challenges
      1. 1.3.1 Influence of Y-Capacitors
      2. 1.3.2 High Potential Testing
      3. 1.3.3 Wide AC Voltage Range
  4. 2Insulation Monitoring Architectures
    1. 2.1 Basic Architecture
    2. 2.2 Dual-Switch Architecture
    3. 2.3 Active Single-Switch Architecture
    4. 2.4 Architecture Comparison
  5. 3Key Components
    1. 3.1 Solid-State Relay
    2. 3.2 Voltage Sensor
    3. 3.3 DC Power Supply
  6. 4Summary
  7. 5Reference
  8.   Trademarks

1.3.2 High Potential Testing

Typically, a Hi-pot test is performed between the AC side of the onboard charger and protective earth. Figure 1-4 illustrates the standard Hi‑pot test setup. According to GB/T 18487.1‑2023, a test voltage of two 830V DC is applied when the rated insulation voltage of the equipment is between 690V and 800V. The Hi‑pot test imposes two principal requirements on the IMD circuit:

  • Withstand voltage: The IMD must tolerate the full stress of two 830V DC without degradation or failure.
  • Leakage current limit: During the voltage application, the measured current leakage must remain below the threshold specified by the standard.
TPSI2140 AMC0381 TPS61170 Diagram of Hi-pot Testing Figure 1-4 Diagram of Hi-pot Testing