SLUUCT7D May   2023  – May 2025 BQ25756

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Device Information
    4. 1.4 General Texas Instruments High Voltage Evaluation (TI HV EMV) User Safety Guidelines
      1. 1.4.1 General Safety Information
  7. 2Hardware
    1. 2.1 Board Parameters
    2. 2.2 IO and Jumper Descriptions
    3. 2.3 Recommended Operating Conditions
    4. 2.4 Communication Interface Setup
      1. 2.4.1 BQSTUDIO Using EV2400
      2. 2.4.2 TI Charger GUI for USB2ANY
    5. 2.5 Equipment
      1. 2.5.1 Equipment Setup
  8. 3Hardware Design Files
    1. 3.1 Schematic
    2. 3.2 PCB Layout
    3. 3.3 Bill of Materials
  9. 4Additional Information
    1. 4.1 Trademarks
  10. 5Revision History

2.1 Board Parameters

Table 2-1 Default Board Setup for BQ25756EVM
Description Value Unit
ACUV Input undervoltage 10 V
ACOV Input overvoltage 55 V
ILIM_HIZ Input current of the EVM 8 A
ICHG Output current of the EVM 10 A
FSW_SYNC Switching frequency of the power stage250 KHz
VBAT_REG Battery charge voltage

29.4

V
IAC Sense Resistor Input current sense resistor 5(1) mΩ
(1) Previous EVMs were built with a 2mΩ sense resistor and current EVMs are built with a 5mΩ to allow the EVM to work with the TPS25751EVM
Table 2-2 PCB and Mechanical Parameters
ValueUnit
Board Size (X dimension, or length)112mm
Board Size (Y dimension, or width)84mm
IC + power stage max height5mm
Total Copper Layers6layer
Copper weight per layer2oz
Total board thickness62mil