SPRUIY3 February   2023 TMS320F2800133 , TMS320F2800135 , TMS320F2800137 , TMS320F2800152-Q1 , TMS320F2800153-Q1 , TMS320F2800154-Q1 , TMS320F2800155 , TMS320F2800155-Q1 , TMS320F2800156-Q1 , TMS320F2800157 , TMS320F2800157-Q1 , TMS320F280021 , TMS320F280021-Q1 , TMS320F280023 , TMS320F280023-Q1 , TMS320F280023C , TMS320F280025 , TMS320F280025-Q1 , TMS320F280025C , TMS320F280025C-Q1

 

  1.   Abstract
  2.   Trademarks
  3. 1Feature Differences Between F28002x, F280015x and F280013x
    1. 1.1 F28002x, F280015x and F280013x Feature Comparison
      1. 1.1.1 F28002x, F280013x and F280015x Superset Device Comparison
  4. 2PCB Hardware Changes
    1. 2.1 PCB Hardware Changes for the 80-Pin PN, 64-Pin PM and 48-Pin PT or PHP Packages
    2. 2.2 New and Existing PCB Migration
  5. 3Feature Differences for System Consideration
    1. 3.1 New Features in F280013x and F280015x
      1. 3.1.1 Secure Boot/JTAG Lock
      2. 3.1.2 Embedded Pattern Generator (EPG)
      3. 3.1.3 Lockstep Compare Module (LCM)
      4. 3.1.4 INTOSC External Precision Resistor (ExtR)
    2. 3.2 Communication Module Changes
    3. 3.3 Control Module Changes
    4. 3.4 Analog Module Differences
      1. 3.4.1 CMPSS Module Variants
    5. 3.5 Other Device Changes
      1. 3.5.1 PIE Channel Mapping
      2. 3.5.2 Bootrom
      3. 3.5.3 CLB and Motor Control Libraries
      4. 3.5.4 AGPIO
        1. 3.5.4.1 AGPIO Filter
        2. 3.5.4.2 Digital Inputs and Outputs on ADC Pins (AGPIOs)
    6. 3.6 Power Management
      1. 3.6.1 LDO/VREG
      2. 3.6.2 POR/BOR
      3. 3.6.3 Power Consumption
    7. 3.7 Memory Module Changes
    8. 3.8 GPIO Multiplexing Changes
    9. 3.9 Analog Multiplexing Changes
  6. 4Application Code Migration From F28002x to F280015x or F280013x
    1. 4.1 C2000Ware Header Files
    2. 4.2 Linker Command Files
    3. 4.3 C2000Ware Examples
  7. 5Specific Use Cases Related to F280015x and F280013x New Features
    1. 5.1 EPG
  8. 6EABI Support
    1. 6.1 Flash API
  9. 7References

Control Module Changes

There are minimal changes in the control modules between the F28002x, F280015x and F280013x devices. Table 3-2 shows the module instances differences that should be considered when migrating applications between F28002x, F280015x and F280013x.

Table 3-2 Control Module Differences
Module Category F28002x F280015x F280013x Notes
eQEP Number 2 - EQEP1, EQEP2 1 - EQEP1
eCAP Number 3 - ECAP1..3 2 - ECAP1..2
HRCAP Number 1 - HRCAP3

Not present

ePWM Number 7 - EPWM1..7 Blanking window improvements on F280013x/15x
Registers - DCACTL.EVT1LATSEL DCAEVT1 Latched Signal Select
- DCACTL.EVT1LATCLRSEL DCAEVT1 Latched Clear Source Select
- DCACTL.EVT1LAT Indicates the status of DCAEVT1LAT signal
- DCACTL.EVT2LATSEL DCAEVT2 Latched Signal Select
- DCACTL.EVT2LATCLRSEL DCAEVT2 Latched Clear Source Select
- DCACTL.EVT2LAT Indicates the status of DCAEVT2LAT signal
- DCBCTL.EVT1LATSEL DCBEVT1 Latched Signal Select
- DCBCTL.EVT1LATCLRSEL DCBEVT1 Latched Clear Source Select
- DCBCTL.EVT1LAT Indicates the status of DCBEVT1LAT signal
- DCBCTL.EVT2LATSEL DCBEVT2 Latched Signal Select
- DCBCTL.EVT2LATCLRSEL DCBEVT2 Latched Clear Source Select
- DCBCTL.EVT2LAT Indicates the status of DCBEVT2LAT signal
DCFCCTL.PULSESEL DCFCCTL.PULSESEL Blank Pulse Mix added as an option for F280013x/15x
HRPWM Number 4 - HRPWM1..4 2 - HRPWM1..2