TIDT242 November   2022

 

  1.   Description
  2.   Features
  3.   Applications
  4. 1Test Prerequisites
    1. 1.1 Voltage and Current Requirements
    2. 1.2 Required Equipment
    3. 1.3 Dimensions
  5. 2Testing and Results
    1. 2.1 Efficiency Graph
    2. 2.2 Efficiency Data
    3. 2.3 Thermal Images
    4. 2.4 EMI - Conducted Emissions
    5. 2.5 Bode Plots
  6. 3Waveforms
    1. 3.1 Switching
    2. 3.2 Output Voltage Ripple

Thermal Images

The thermal images are shown in the following figures. The ambient temperature is 25°C, and the thermal images were taken with 13.5-V input and all outputs at a full load of 3 A. The controller was operated for approximately 30 minutes before thermal images were taken to ensure the thermal steady state was reached. The board is 4-layer PCB, the copper of the top and bottom layers is 2 oz, and the copper of middle layers is
1 oz.

GUID-20221109-SS0I-H2WV-GFVK-1V7DQZ33SKBD-low.pngFigure 2-2 Top Side Thermal Image,
VPA_BUS = VPB_BUS = 5 V
GUID-20221127-SS0I-CR7T-F0S2-J1PBTHJJZLBG-low.pngFigure 2-4 Top Side Thermal Image,
VPA_BUS = VPB_BUS = 9 V
GUID-20221127-SS0I-M6NR-SDBR-0JDQTV0C7FWR-low.pngFigure 2-6 Top Side Thermal Image,
VPA_BUS = VPB_BUS = 15 V
GUID-20221109-SS0I-VR80-KWLW-18JKM4NPNF6T-low.pngFigure 2-8 Top Side Thermal Image,
VPA_BUS = VPB_BUS = 20 V
GUID-20221109-SS0I-ZNQK-H8VQ-LWCV3JNM9TMH-low.pngFigure 2-3 Bottom Side Thermal Image,
VPA_BUS = VPB_BUS = 5 V
GUID-20221127-SS0I-RSGJ-WHQZ-FQPFZ6NWTVDR-low.pngFigure 2-5 Bottom Side Thermal Image,
VPA_BUS = VPB_BUS = 9 V
GUID-20221127-SS0I-C1WW-RSDP-QQFGVBJJ2TSH-low.pngFigure 2-7 Bottom Side Thermal Image,
VPA_BUS = VPB_BUS = 15 V
GUID-20221109-SS0I-RQLQ-XLBJ-QRTHW5KC29T7-low.pngFigure 2-9 Bottom Side Thermal Image,
VPA_BUS = VPB_BUS = 20 V