TIDT257A February   2022  – October 2022

 

  1.   Description
  2.   Features
  3.   Application
  4. 1Test Prerequisites
    1. 1.1 Voltage and Current Requirements
    2. 1.2 Considerations
    3. 1.3 Dimensions
  5. 2Testing and Results
    1. 2.1 Efficiency Graphs
    2. 2.2 Efficiency Data
      1. 2.2.1 THD Optimization
    3. 2.3 Thermal Images
      1. 2.3.1 Low-Side GaN Junction Temperature
    4. 2.4 Thermal Mechanical Design
      1. 2.4.1 Design Parameters
      2. 2.4.2 Thermal Resistance Calculation
      3. 2.4.3 Heat-Sink Diagrams
    5. 2.5 EMI
  6. 3Waveforms
    1. 3.1 AC Drop
    2. 3.2 Load Transients
    3. 3.3 Start-Up Sequence

2.2.1 THD Optimization

Conditions

  • Frequency: 100 kHz
  • Maximum load: 3 kW
  • GaN Slew Rate: 100 V/ns
  • Output: 385 V
  • Power analyzer: WT3000E
GUID-20221006-SS0I-4B0X-GSCH-ZBXTMHSM4FCQ-low.png Figure 2-2 THD
GUID-20221006-SS0I-GXWL-BLSZ-DDR87C28W33N-low.png Figure 2-3 Power Factor