TIDT363 December   2023

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5. 1Test Prerequisites
    1. 1.1 Voltage and Current Requirements
    2. 1.2 Considerations
    3. 1.3 Dimensions
  6. 2Testing and Results
    1. 2.1 Efficiency Graphs
    2. 2.2 Efficiency Data
    3. 2.3 Thermal Images
    4. 2.4 EMI
      1. 2.4.1 Conducted Emissions
        1. 2.4.1.1 Noise Floor
        2. 2.4.1.2 Conducted Emissions Measurement
      2. 2.4.2 Radiated Emissions
        1. 2.4.2.1 Frequencies of 150 kHz to 30 MHz
          1. 2.4.2.1.1 Noise Floor
          2. 2.4.2.1.2 Emissions
        2. 2.4.2.2 Frequencies of 30 MHz to 200 MHz
          1. 2.4.2.2.1 Horizontal Polarization
            1. 2.4.2.2.1.1 Noise Floor
            2. 2.4.2.2.1.2 Emissions
          2. 2.4.2.2.2 Vertical Polarizations
            1. 2.4.2.2.2.1 Noise Floor
            2. 2.4.2.2.2.2 Emissions
        3. 2.4.2.3 Frequencies from 200 MHz to 1 GHz
          1. 2.4.2.3.1 Horizontal Polarization
            1. 2.4.2.3.1.1 Noise Floor
            2. 2.4.2.3.1.2 Emissions
          2. 2.4.2.3.2 Vertical Polarization
            1. 2.4.2.3.2.1 Noise Floor
            2. 2.4.2.3.2.2 Emissions
  7. 3Waveforms
    1. 3.1 Switching
    2. 3.2 Load Transients
    3. 3.3 Start-Up

Dimensions

The board has 6 layers with the dimensions of 115 mm × 81 mm. The inner 4 layers are with 70-µm copper thickness and the outer layers are with 35 µm.