TIDT363 December   2023

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5. 1Test Prerequisites
    1. 1.1 Voltage and Current Requirements
    2. 1.2 Considerations
    3. 1.3 Dimensions
  6. 2Testing and Results
    1. 2.1 Efficiency Graphs
    2. 2.2 Efficiency Data
    3. 2.3 Thermal Images
    4. 2.4 EMI
      1. 2.4.1 Conducted Emissions
        1. 2.4.1.1 Noise Floor
        2. 2.4.1.2 Conducted Emissions Measurement
      2. 2.4.2 Radiated Emissions
        1. 2.4.2.1 Frequencies of 150 kHz to 30 MHz
          1. 2.4.2.1.1 Noise Floor
          2. 2.4.2.1.2 Emissions
        2. 2.4.2.2 Frequencies of 30 MHz to 200 MHz
          1. 2.4.2.2.1 Horizontal Polarization
            1. 2.4.2.2.1.1 Noise Floor
            2. 2.4.2.2.1.2 Emissions
          2. 2.4.2.2.2 Vertical Polarizations
            1. 2.4.2.2.2.1 Noise Floor
            2. 2.4.2.2.2.2 Emissions
        3. 2.4.2.3 Frequencies from 200 MHz to 1 GHz
          1. 2.4.2.3.1 Horizontal Polarization
            1. 2.4.2.3.1.1 Noise Floor
            2. 2.4.2.3.1.2 Emissions
          2. 2.4.2.3.2 Vertical Polarization
            1. 2.4.2.3.2.1 Noise Floor
            2. 2.4.2.3.2.2 Emissions
  7. 3Waveforms
    1. 3.1 Switching
    2. 3.2 Load Transients
    3. 3.3 Start-Up

2.3 Thermal Images

For thermal testing, the PCB was placed flat on the bench with no artificial air flow at 25°C ambient temperature.

The image was taken after thermal equilibrium was reached.

GUID-20231110-SS0I-1LNG-B1XF-VZKH6ZXWMRSH-low.png Figure 2-2 Thermal Image, 22-A Load Current