SBAS569B May   2013  – February 2019 ADS8860

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      No Separate LDO Required for the ADC Supply
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements: 3-Wire Operation
    7. 7.7 Timing Requirements: 4-Wire Operation
    8. 7.8 Timing Requirements: Daisy-Chain
    9. 7.9 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Equivalent Circuits
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Analog Input
      2. 9.3.2 Reference
      3. 9.3.3 Clock
      4. 9.3.4 ADC Transfer Function
    4. 9.4 Device Functional Modes
      1. 9.4.1 CS Mode
        1. 9.4.1.1 3-Wire CS Mode Without a Busy Indicator
        2. 9.4.1.2 3-Wire CS Mode With a Busy Indicator
        3. 9.4.1.3 4-Wire CS Mode Without a Busy Indicator
        4. 9.4.1.4 4-Wire CS Mode With a Busy Indicator
      2. 9.4.2 Daisy-Chain Mode
        1. 9.4.2.1 Daisy-Chain Mode Without a Busy Indicator
        2. 9.4.2.2 Daisy-Chain Mode With a Busy Indicator
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 ADC Reference Driver
      2. 10.1.2 ADC Input Driver
        1. 10.1.2.1 Input Amplifier Selection
        2. 10.1.2.2 Charge-Kickback Filter
    2. 10.2 Typical Applications
      1. 10.2.1 DAQ Circuit for a 1-µs, Full-Scale Step Response
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
      2. 10.2.2 DAQ Circuit for Lowest Distortion and Noise Performance at 1 MSPS
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
      3. 10.2.3 Ultralow-Power DAQ Circuit at 10 kSPS
        1. 10.2.3.1 Design Requirements
        2. 10.2.3.2 Detailed Design Procedure
  11. 11Power Supply Recommendations
    1. 11.1 Power-Supply Decoupling
    2. 11.2 Power Saving
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Community Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

6 Pin Configuration and Functions

DGS Package
10-Pin VSSOP
Top View
DRC Package
10-Pin VSON
Top View

Pin Functions

PIN TYPE DESCRIPTION
NAME NO.
AINN 4 Analog input Inverting analog signal input
AINP 3 Analog input Noninverting analog signal input
AVDD 2 Analog Analog power supply. This pin must be decoupled to GND with a 1-µF capacitor.
CONVST 6 Digital input Convert input. This pin also functions as the CS input in 3-wire interface mode; see the Description and Timing Requirements sections for more details.
DIN 9 Digital input Serial data input. The DIN level at the start of a conversion selects the mode of operation (such as CS or daisy-chain mode). This pin also serves as the CS input in 4-wire interface mode; see the Description and Timing Requirements sections for more details.
DOUT 7 Digital output Serial data output
DVDD 10 Power supply Digital interface power supply. This pin must be decoupled to GND with a 1-µF capacitor.
GND 5 Analog, digital Device ground. Note that this pin is a common ground pin for both the analog power supply (AVDD) and digital I/O supply (DVDD). The reference return line is also internally connected to this pin.
REF 1 Analog Positive reference input. This pin must be decoupled with a 10-µF or larger capacitor.
SCLK 8 Digital input Clock input for serial interface. Data output (on DOUT) are synchronized with this clock.
Thermal pad — Exposed thermal pad (only for the DRC package option). Texas Instruments recommends connecting the thermal pad to the printed circuit board (PCB) ground.