SBAS629C October   2015  – April 2026 ADS9110

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Requirements: Conversion Cycle
    7. 5.7  Timing Requirements: Asynchronous Reset, NAP, and PD
    8. 5.8  Timing Requirements: SPI-Compatible Serial Interface
    9. 5.9  Timing Requirements: Source-Synchronous Serial Interface (External Clock)
    10. 5.10 Timing Requirements: Source-Synchronous Serial Interface (Internal Clock)
    11. 5.11 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Converter Module
        1. 6.3.1.1 Sample-and-Hold Circuit
        2. 6.3.1.2 External Reference Source
        3. 6.3.1.3 Internal Oscillator
        4. 6.3.1.4 ADC Transfer Function
      2. 6.3.2 Interface Module
    4. 6.4 Device Functional Modes
      1. 6.4.1 RST State
      2. 6.4.2 ACQ State
      3. 6.4.3 CNV State
    5. 6.5 Programming
      1. 6.5.1 Data Transfer Frame
      2. 6.5.2 Interleaving Conversion Cycles and Data Transfer Frames
      3. 6.5.3 Data Transfer Protocols
        1. 6.5.3.1 Protocols for Configuring the Device
        2. 6.5.3.2 Protocols for Reading From the Device
          1. 6.5.3.2.1 Legacy, SPI-Compatible (SYS-xy-S) Protocols
          2. 6.5.3.2.2 SPI-Compatible Protocols with Bus Width Options
          3. 6.5.3.2.3 Source-Synchronous (SRC) Protocols
            1. 6.5.3.2.3.1 Output Clock Source Options with SRC Protocols
            2. 6.5.3.2.3.2 Bus Width Options with SRC Protocols
            3. 6.5.3.2.3.3 Output Data Rate Options with SRC Protocols
      4. 6.5.4 Device Setup
        1. 6.5.4.1 Single Device: All multiSPI™ Options
        2. 6.5.4.2 Single Device: Minimum Pins for a Standard SPI Interface
        3. 6.5.4.3 Multiple Devices: Daisy-Chain Topology
        4. 6.5.4.4 Multiple Devices: Star Topology
    6. 6.6 Register Maps
      1. 6.6.1 Device Configuration and Register Maps
        1. 6.6.1.1 PD_CNTL Register (address = 010h)
        2. 6.6.1.2 SDI_CNTL Register (address = 014h)
        3. 6.6.1.3 SDO_CNTL Register (address = 018h)
        4. 6.6.1.4 DATA_CNTL Register (address = 01Ch)
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 ADC Input Driver
      2. 7.1.2 Input Amplifier Selection
      3. 7.1.3 Charge Kickback Filter
      4. 7.1.4 ADC Reference Driver
    2. 7.2 Typical Application
      1. 7.2.1 Data Acquisition (DAQ) Circuit for Lowest Distortion and Noise Performance With Differential Input
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curves
      2. 7.2.2 DAQ Circuit With FDA Input Driver and Single-Ended or Differential Input
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
        3. 7.2.2.3 Application Curves
  9. 8 Power-Supply Recommendations
    1. 8.1 Power-Supply Decoupling
    2. 8.2 Power Saving
      1. 8.2.1 NAP Mode
      2. 8.2.2 PD Mode
  10. 9 Layout
    1. 9.1 Layout Guidelines
      1. 9.1.1 Signal Path
      2. 9.1.2 Grounding and PCB Stack-Up
      3. 9.1.3 Decoupling of Power Supplies
      4. 9.1.4 Reference Decoupling
      5. 9.1.5 Differential Input Decoupling
    2. 9.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

6.5.3 Data Transfer Protocols

The device features a multiSPI™ interface that allows the host controller to operate at slower SCLK speeds and still achieve the required cycle time with a faster response time. The multiSPI™ interface module offers two options to reduce the SCLK speed required for data transfer:

  1. An option to increase the width of the output data bus
  2. An option to enable double data rate (DDR) transfer

These two options can be combined to achieve further reduction in SCLK speed.

Figure 6-15 shows the delays between the host controller and the device in a typical serial communication.

ADS9110 Delays in Serial CommunicationFigure 6-15 Delays in Serial Communication

If tpcb_CK and tpcb_SDO are the delays introduced by the PCB traces for the serial clock and SDO signals, td_CKDO is the clock-to-data delay of the device, td_ISO is the propagation delay introduced by the digital isolator, and tsu_h is the set up time specification of the host controller, then the total delay in the path is given by Equation 11:

Equation 11. ADS9110

In a standard SPI protocol, the host controller and the device launch and capture data bits on alternate SCLK edges. Therefore, the td_total_serial delay must be kept less than half of the SCLK duration. Equation 12 shows the fastest clock allowed by the SPI protocol.

Equation 12. ADS9110

Larger values of the td_total_serial delay restrict the maximum SCLK speed for the SPI protocol, resulting in higher read and response times, and can increase cycle times. To remove this restriction on the SCLK speed, the multiSPI™ interface module supports an ADC-Clock-Master or a source-synchronous mode of operation.

As illustrated in Figure 6-16, in the ADC-Clock-Master or source-synchronous mode, the device provides a synchronous output clock (on the RVS pin) along with the output data (on the SDO-x pins).

For negligible values of toff_STRDO, the total delay in the path for a source-synchronous data transfer, is given by Equation 13:

Equation 13. ADS9110

As illustrated in Equation 11 and Equation 13, the ADC-Clock-Master or source-synchronous mode completely eliminates the affect of isolator delays (td_ISO) and the clock-to-data delays (td_CKDO), which are typically the largest contributors in the overall delay computation.

ADS9110 Delays in Source-Synchronous CommunicationFigure 6-16 Delays in Source-Synchronous Communication

Furthermore, the actual values of tpcb_RVS and tpcb_SDO do not matter. In most cases, the td_total_srcsync delay can be kept at a minimum by routing the RVS and SDO lines together on the PCB. Therefore, the ADC-Clock-Master or source-synchronous mode allows the data transfer between the host controller and the device to operate at much higher SCLK speeds.