SBAS629C October   2015  – April 2026 ADS9110

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Requirements: Conversion Cycle
    7. 5.7  Timing Requirements: Asynchronous Reset, NAP, and PD
    8. 5.8  Timing Requirements: SPI-Compatible Serial Interface
    9. 5.9  Timing Requirements: Source-Synchronous Serial Interface (External Clock)
    10. 5.10 Timing Requirements: Source-Synchronous Serial Interface (Internal Clock)
    11. 5.11 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Converter Module
        1. 6.3.1.1 Sample-and-Hold Circuit
        2. 6.3.1.2 External Reference Source
        3. 6.3.1.3 Internal Oscillator
        4. 6.3.1.4 ADC Transfer Function
      2. 6.3.2 Interface Module
    4. 6.4 Device Functional Modes
      1. 6.4.1 RST State
      2. 6.4.2 ACQ State
      3. 6.4.3 CNV State
    5. 6.5 Programming
      1. 6.5.1 Data Transfer Frame
      2. 6.5.2 Interleaving Conversion Cycles and Data Transfer Frames
      3. 6.5.3 Data Transfer Protocols
        1. 6.5.3.1 Protocols for Configuring the Device
        2. 6.5.3.2 Protocols for Reading From the Device
          1. 6.5.3.2.1 Legacy, SPI-Compatible (SYS-xy-S) Protocols
          2. 6.5.3.2.2 SPI-Compatible Protocols with Bus Width Options
          3. 6.5.3.2.3 Source-Synchronous (SRC) Protocols
            1. 6.5.3.2.3.1 Output Clock Source Options with SRC Protocols
            2. 6.5.3.2.3.2 Bus Width Options with SRC Protocols
            3. 6.5.3.2.3.3 Output Data Rate Options with SRC Protocols
      4. 6.5.4 Device Setup
        1. 6.5.4.1 Single Device: All multiSPI™ Options
        2. 6.5.4.2 Single Device: Minimum Pins for a Standard SPI Interface
        3. 6.5.4.3 Multiple Devices: Daisy-Chain Topology
        4. 6.5.4.4 Multiple Devices: Star Topology
    6. 6.6 Register Maps
      1. 6.6.1 Device Configuration and Register Maps
        1. 6.6.1.1 PD_CNTL Register (address = 010h)
        2. 6.6.1.2 SDI_CNTL Register (address = 014h)
        3. 6.6.1.3 SDO_CNTL Register (address = 018h)
        4. 6.6.1.4 DATA_CNTL Register (address = 01Ch)
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 ADC Input Driver
      2. 7.1.2 Input Amplifier Selection
      3. 7.1.3 Charge Kickback Filter
      4. 7.1.4 ADC Reference Driver
    2. 7.2 Typical Application
      1. 7.2.1 Data Acquisition (DAQ) Circuit for Lowest Distortion and Noise Performance With Differential Input
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curves
      2. 7.2.2 DAQ Circuit With FDA Input Driver and Single-Ended or Differential Input
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
        3. 7.2.2.3 Application Curves
  9. 8 Power-Supply Recommendations
    1. 8.1 Power-Supply Decoupling
    2. 8.2 Power Saving
      1. 8.2.1 NAP Mode
      2. 8.2.2 PD Mode
  10. 9 Layout
    1. 9.1 Layout Guidelines
      1. 9.1.1 Signal Path
      2. 9.1.2 Grounding and PCB Stack-Up
      3. 9.1.3 Decoupling of Power Supplies
      4. 9.1.4 Reference Decoupling
      5. 9.1.5 Differential Input Decoupling
    2. 9.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

9.1.4 Reference Decoupling

Dynamic currents are also present at the REFP and REFM pins during the conversion phase and excellent decoupling is required to achieve optimum performance. Three 10-μF, X7R-grade, ceramic capacitors with 10-V rating are recommended, placed as illustrated in Figure 9-1. Select 0603- or 0805-size capacitors to keep ESL low. The REFM pin of each pair must be connected to the decoupling capacitor before a ground via.