SBAS729C June   2016  – August 2026 ADS8920B , ADS8922B , ADS8924B

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Switching Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 LDO Module
      2. 6.3.2 Reference Buffer Module
      3. 6.3.3 Converter Module
        1. 6.3.3.1 Sample-and-Hold Circuit
        2. 6.3.3.2 Internal Oscillator
        3. 6.3.3.3 ADC Transfer Function
      4. 6.3.4 Interface Module
    4. 6.4 Device Functional Modes
      1. 6.4.1 RST State
      2. 6.4.2 ACQ State
      3. 6.4.3 CNV State
    5. 6.5 Programming
      1. 6.5.1 Output Data Word
      2. 6.5.2 Data Transfer Frame
      3. 6.5.3 Interleaving Conversion Cycles and Data Transfer Frames
      4. 6.5.4 Data Transfer Protocols
        1. 6.5.4.1 Protocols for Configuring the Device
        2. 6.5.4.2 Protocols for Reading From the Device
          1. 6.5.4.2.1 Legacy, SPI-Compatible (SYS-xy-S) Protocols
          2. 6.5.4.2.2 SPI-Compatible Protocols with Bus Width Options
          3. 6.5.4.2.3 Source-Synchronous (SRC) Protocols
            1. 6.5.4.2.3.1 Output Clock Source Options with SRC Protocols
            2. 6.5.4.2.3.2 Bus Width Options With SRC Protocols
            3. 6.5.4.2.3.3 Output Data Rate Options With SRC Protocols
      5. 6.5.5 Device Setup
        1. 6.5.5.1 Single Device: All multiSPI Options
        2. 6.5.5.2 Single Device: Minimum Pins for a Standard SPI
        3. 6.5.5.3 Multiple Devices: Daisy-Chain Topology
        4. 6.5.5.4 Multiple Devices: Star Topology
  8. 7 Register Maps
    1. 7.1 Device Configuration and Register Maps
      1. 7.1.1 PD_CNTL Register (address = 04h) [reset = 08h]
      2. 7.1.2 SDI_CNTL Register (address = 008h) [reset = 00h]
      3. 7.1.3 SDO_CNTL Register (address = 0Ch) [reset = 00h]
      4. 7.1.4 DATA_CNTL Register (address = 010h) [reset = 00h]
      5. 7.1.5 PATN_LSB Register (address = 014h) [reset = 00h]
      6. 7.1.6 PATN_MID Register (address = 015h) [reset = 00h]
      7. 7.1.7 PATN_MSB Register (address = 016h) [reset = 00h]
      8. 7.1.8 OFST_CAL Register (address = 020h) [reset = 00h]
      9. 7.1.9 REF_MRG Register (address = 030h) [reset = 00h]
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 ADC Reference Driver
      2. 8.1.2 ADC Input Driver
        1. 8.1.2.1 Charge-Kickback Filter
        2. 8.1.2.2 Input Amplifier Selection
    2. 8.2 Typical Application
      1. 8.2.1 Data Acquisition (DAQ) Circuit for Lowest Distortion and Noise Performance With Differential Input
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 DAQ Circuit With FDA Input Driver and Single-Ended or Differential Input
      3. 8.2.3 Design Requirements
      4. 8.2.4 Detailed Design Procedure
      5. 8.2.5 Application Curves
    3. 8.3 Power-Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Signal Path
        2. 8.4.1.2 Grounding and PCB Stack-Up
        3. 8.4.1.3 Decoupling of Power Supplies
        4. 8.4.1.4 Reference Decoupling
        5. 8.4.1.5 Differential Input Decoupling
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Data Transfer Protocols

This device family features a multiSPI digital interface that allows the host controller to operate at slower SCLK speeds and still achieve the required throughput and response time. The multiSPI digital interface module offers three options to reduce the SCLK speed required for data transfer:

  • Increase the width of the output data bus.
  • Enable double data rate (DDR) transfer.
  • Extended data transfer window, as shown in Figure 6-17.

These three options can be combined to achieve further reduction in SCLK speed.

There are various factors that limit the maximum SCLK frequency in a system.

Figure 6-18 shows the delays in the communication channel between the host controller and the device in a typical serial communication.

ADS8920B ADS8922B ADS8924B Delays in
                    Serial Communication Figure 6-18 Delays in Serial Communication

For example, if tpcb_CK and tpcb_SDO are the delays introduced by the printed circuit board (PCB) traces for the serial clock and SDO signals, td_CKDO is the clock-to-data delay of the device, td_ISO is the propagation delay introduced by the digital isolator, and tsu_h is the setup time specification of the host controller, then the total delay in the path is given by Equation 12:

Equation 12. t d _ t o t a l _ s e r i a l = t p c b _ C K + t d _ i s o + t d _ c k d o + t d _ i s o + t p c b _ S D O + t s u _ h

In a standard SPI protocol, the host controller and the device launch and capture data bits on alternate SCLK edges. Therefore, the td_total_serial delay must be kept to less than half of the SCLK duration. Equation 13 shows the fastest clock allowed by the SPI protocol:

Equation 13. f clk-SPI ≤ 1 2 × t d\_total-serial

Larger values of the td_total_serial delay restricts the maximum SCLK speed for the SPI protocol, resulting in higher read and response times, and can possibly limit the throughput.

Figure 6-19 shows a delay (td_delcap) introduced in the capture path (inside the host controller).

ADS8920B ADS8922B ADS8924B Delayed
                    Capture Figure 6-19 Delayed Capture

The total delay in the path modifies to Equation 14:

Equation 14. t d _ t o t a l _ s e r i a l = t p c b _ C K + t d _ i s o + t d _ c k d o + t d _ i s o + t p c b _ S D O + t s u _ h − t d _ d e l c a p

This reduction in total delay allows the SPI protocol to operate at higher clock speeds.

The multiSPI digital interface module offers two additional options to remove the restriction on the SCLK speed:

  • Early data launch (EDL) mode of operation

    In EDL mode, the device launches the output data on SDO-x pin (or pins) half a clock earlier compared to the standard SPI protocol. Therefore, Equation 13 modifies to Equation 15:

    Equation 15. f ck-SPI ≤ 1 t d\_total-serial

    The reduction in total delay allows the serial interface to operate at higher clock speeds.

  • ADC-Clock-Master (source-synchronous) mode of operation

    As illustrated in Figure 6-20, in ADC-Clock-Master mode, the device provides a synchronous output clock (on the RVS pin) along with the output data (on the SDO-x pins).

    ADS8920B ADS8922B ADS8924B Delays in ADC-Clock-Master (Source-Synchronous) Mode Figure 6-20 Delays in ADC-Clock-Master (Source-Synchronous) Mode

    For negligible values of toff_STRDO, the total delay in the path for a source-synchronous data transfer, is given by Equation 16:

    Equation 16. t d_total_srcsync = t pcb_RVS − t pcb_SDO + t su_h

    As shown by the difference between Equation 12 and Equation 16, using ADC-Clock-Master mode completely eliminates the effect of isolator delays (td_ISO) and clock-to-data delays (td_CKDO); typically, the largest contributors in the overall delay computation.

    Furthermore, the actual values of tpcb_RVS and tpcb_SDO do not matter. In most cases, the td_total_srcsync delay can be kept at a minimum by routing the RVS and SDO lines together on the PCB. Therefore, the ADC-Clock-Master mode allows the data transfer between the host controller and the device to operate at much higher SCLK speeds.