SBASB13B December   2024  – November 2025 AMC0311S

PRODMIX  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information (D Package)
    5. 6.5  Thermal Information (DWV Package)
    6. 6.6  Power Ratings 
    7. 6.7  Insulation Specifications (Basic Isolation)
    8. 6.8  Insulation Specifications (Reinforced Isolation)
    9. 6.9  Safety-Related Certifications (Basic Isolation)
    10. 6.10 Safety-Related Certifications (Reinforced Isolation)
    11. 6.11 Safety Limiting Values (D Package)
    12. 6.12 Safety Limiting Values (DWV Package)
    13. 6.13 Electrical Characteristics
    14. 6.14 Switching Characteristics
    15. 6.15 Timing Diagram
    16. 6.16 Insulation Characteristics Curves
    17. 6.17 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Input
      2. 7.3.2 Isolation Channel Signal Transmission
      3. 7.3.3 Analog Output
      4. 7.3.4 Reference Input
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Filter Design
        2. 8.2.2.2 Connecting the REFIN Pin
      3. 8.2.3 Application Curve
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Revision History

Changes from August 23, 2025 to November 17, 2025 (from Revision A (August 2025) to Revision B (November 2025))

  • Changed AMC0211S device status from Product Preview to Production Data Go
  • Added IREFIN specification to Electrical Characteristics tableGo
  • Added VOUT,SAT parameter to Electrical Characteristics tableGo

Changes from December 2, 2024 to August 22, 2025 (from Revision * (December 2024) to Revision A (August 2025))

  • Changed MAX ambient temperature from 105°C to 125°CGo
  • Changed RINP (min) from 0.1GΩ to 0.05GΩ and (typ) from 1GΩ to 2.4GΩGo
  • Changed CMTI (min) from 50V/ns to 150V/nsGo
  • Changed TCVOS limits from ±25µV/°C to ±30µV/°CGo
  • Changed TCEG (max) from ±40ppm/°C to ±50ppm/°C Go
  • Changed nonlinearity limits from ±0.02% to ±0.08%Go
  • Changed output noise (typ) from 220µVRMS to 180µVRMS Go
  • Changed VDD1 DC PSSR (typ) from –80dB to –77dBGo
  • Changed VDD1 AC PSRR (typ) from –56dB to –59dBGo
  • Changed VDD2 DC PSRR (typ) from –90dB to –100dBGo
  • Changed output bandwidth from 100kHz (min), 125kHz (typ) to 120kHz (min), 145kHz (typ)Go
  • Changed THD (typ) from –77dB to –83dB and added (max) valueGo
  • Changed SNR (min) from 76dB to 75dBGo
  • Changed IDD1 (max) from 6.0mA to 5.6mAGo
  • Changed IDD2 (max) from 7.0mA to 7.4mAGo
  • Changed VDD1UV (rising) (max) from 2.7V to 2.8VGo
  • Changed VDD1UV (falling) (typ) from 2.0V to 2.05V and (max) from 2.1V to 2.2VGo
  • Changed VDD2UV (rising) (min) from 2.4V to 2.3V and (typ) from 2.6V to 2.5VGo
  • Changed VDD2UV (falling) (typ) from 2.0V to 2.05V and (max) from 2.1V to 2.2VGo
  • Changed signal delay time (50% – 10%) (typ) from 2.4µs to 1.6µsGo
  • Changed signal delay time (50% – 50%) (typ) from 3.0µs to 2.9µsGo
  • Changed signal delay time (50% – 90%) (typ) from 4.2µs to 4.3µsGo
  • Added upper spec limit of 100µs for analog settling time (tAS)Go
  • Changed Thermal Derating Curves in Insulation Characteristics Curves sectionGo