4 Conclusion

The thermally-enhanced package HVSSOP was estimated to have a lower input offset voltage of 52 uV than a typical package, when dissipating 0.9 W of power. The HVSSOP was also estimated to have a lower input bias current by more than 1000 pA for the same test case. The measured junction-to-ambient thermal resistance for a typical package was 48.1 °C/W higher than the HVSSOP package. High precision applications require minimum sources of error to provide accurate results. Choosing a thermal-enhanced device greatly reduces thermal drift, ensuring the output is highly accurate over a wide temperature range.