SBOS035C December   1995  – January 2026 INA2128

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6Application and Implementation
    1. 6.1 Application Information
    2. 6.2 Typical Application
      1. 6.2.1 Setting The Gain
      2. 6.2.2 Dynamic Performance
      3. 6.2.3 Noise Performance
      4. 6.2.4 Offset Trimming
      5. 6.2.5 Input Bias Current Return Path
      6. 6.2.6 Input Common-Mode Range
      7. 6.2.7 Low-Voltage Operation
      8. 6.2.8 Input Protection
      9. 6.2.9 Channel Crosstalk
  8. 7Device and Documentation Support
    1. 7.1 Device Nomenclature
    2. 7.2 Receiving Notification of Documentation Updates
    3. 7.3 Support Resources
    4. 7.4 Trademarks
    5. 7.5 Electrostatic Discharge Caution
    6. 7.6 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

5 Specifications

Note:

TI has qualified multiple fabrication flows for this device. Differences in performance are labeled by chip site origin (CSO). For system robustness, designing for all flows is highly recommended. For more information, please see Section 8.1.