SBOS035C December   1995  – January 2026 INA2128

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6Application and Implementation
    1. 6.1 Application Information
    2. 6.2 Typical Application
      1. 6.2.1 Setting The Gain
      2. 6.2.2 Dynamic Performance
      3. 6.2.3 Noise Performance
      4. 6.2.4 Offset Trimming
      5. 6.2.5 Input Bias Current Return Path
      6. 6.2.6 Input Common-Mode Range
      7. 6.2.7 Low-Voltage Operation
      8. 6.2.8 Input Protection
      9. 6.2.9 Channel Crosstalk
  8. 7Device and Documentation Support
    1. 7.1 Device Nomenclature
    2. 7.2 Receiving Notification of Documentation Updates
    3. 7.3 Support Resources
    4. 7.4 Trademarks
    5. 7.5 Electrostatic Discharge Caution
    6. 7.6 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

Revision History

Changes from Revision B (May 2023) to Revision C (January 2026)

  • Added different fabrication process specifications for Input bias current in the Features sectionGo
  • Added description of device flow information in the Specifications Go
  • Added all chips site origins (CSO) condition to the typical test conditions in the Electrical CharacteristicsGo
  • Added different fabrication process specifications for Offset voltage (RTI) in the Electrical Characteristics Go
  • Added different fabrication process specifications for Power-supply rejection ratio (RTI) in the Electrical Characteristics Go
  • Added different fabrication process specifications for Long-term stability in the Electrical Characteristics Go
  • Added different fabrication process specifications for Common-mode rejection ratio in the Electrical Characteristics Go
  • Added different fabrication process specifications for Input bias current in the Electrical Characteristics Go
  • Added different fabrication process specifications for Input offset current in the Electrical Characteristics Go
  • Added different fabrication process specifications for Voltage noise (RTI) in the Electrical Characteristics Go
  • Added different fabrication process specifications for Current noise in the Electrical Characteristics Go
  • Added different fabrication process specifications for Gain error in the Electrical Characteristics Go
  • Added different fabrication process specifications for Gain drift in the Electrical Characteristics Go
  • Added different fabrication process specifications for Positive output voltage in the Electrical Characteristics Go
  • Added different fabrication process specifications for Negative output voltage in the Electrical Characteristics Go
  • Added different fabrication process specifications for Short-circuit current in the Electrical Characteristics Go
  • Added different fabrication process specifications for Bandwidth, –3dB in the Electrical Characteristics Go
  • Added different fabrication process specifications for Slew rate in the Electrical CharacteristicsGo
  • Added different fabrication process specifications for Settling time in the Electrical Characteristics Go
  • Added all chips site origins (CSO) condition to the typical test conditions in the Typical Characteristics Go
  • Added CSO: SHE to Common-Mode Rejection vs Frequency, Settling Time vs Gain, Quiescent Current and Slew Rate vs Temperature, Input Overvoltage V/I Characteristics, Input Bias Current vs Temperature, Output Voltage Swing vs Power Supply Voltage, Short Circuit Output Current vs Temperature, Maximum Output Voltage vs Frequency, Total Harmonic Distortion + Noise vs Frequency, and Small-Signal Step Response curves in the Typical Characteristics Go
  • Added CSO: TID to Gain vs Frequency, Positive Power Supply Rejection vs Frequency, Negative Power Supply Rejection vs Frequency, Input-Referred Voltage Noise vs Frequency, Positive Output Voltage Swing vs Output Current, Negative Output Voltage Swing vs Output Current, and Large-Signal Step Response curves in the Typical Characteristics Go
  • Added Gain vs Frequency, Positive Power Supply Rejection vs Frequency, Negative Power Supply Rejection vs Frequency, Input-Referred Noise vs Frequency, Output Voltage Swing vs Output Current, and Large-Signal Step Response curves for CSO: SHE in the Typical Characteristics Go
  • Added Common-Mode Rejection vs Frequency, Input-Referred Current Noise vs Frequency, Input Overvoltage V/I Characteristics, Input Bias Current vs Temperature, Input Offset Current vs Temperature, Maximum Output Voltage vs Frequency, Total Harmonic Distortion + Noise vs Frequency, and Small-Signal Step Response curves for CSO: TID in the Typical Characteristics Go
  • Added Part Number flow information table to the Device Nomenclature Go

Changes from Revision A (April 2007) to Revision B (May 2023)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Added the Package Information table, and the Pin Configuration and Functions, Specifications, Detailed Description, Application and Implementation, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sectionsGo
  • Added input voltage noise, high bandwidth, and temperature range bullets to Features Go
  • Changed Features bullet to show correct package nameGo
  • Changed Applications bullets to show updated linksGo
  • Changed Package Information table column name from BODY SIZE (NOM) to PACKAGE SIZE and added note regarding the package sizeGo
  • Added single supply specification to Absolute Maximum Ratings Go
  • Added note clarifying output short-circuit to ground in Absolute Maximum Ratings refers to short-circuit to VS / 2Go
  • Added single supply specification to Recommended Operating Conditions Go
  • Changed input common-mode voltage range specification from V – 2 to (V–) + 2 in Recommended Operating Conditions Go
  • Deleted INA128-HT and INA129-HT operating temperature specifications from Recommended Operating Conditions Go
  • Added specified temperature range to Recommended Operating Conditions Go
  • Added test conditions below Electrical Characteristics titleGo
  • Changed test condition for offset voltage drift specification in Electrical Characteristics from "TA = TMIN to TMAX" to " TA = –40℃ to +85℃" for clarityGo
  • Changed "±0.5±0/G" to "±0.5±20/G" in MAX column of Offset voltage RTI vs temperature row of Electrical Characteristics.Go
  • Changed typical long-term stability specification from ±0.1±3/GµV/mo to ±0.2±3/GµV/mo in Electrical Characteristics Go
  • Deleted typical specification and changed common-mode voltage specification from (V–) + 2 V minimum and (V+) – 2 V maximum across one row in Electrical CharacteristicsGo
  • Deleted typical VCM specifications in Electrical Characteristics Go
  • Added test condition of "RS = 0 Ω" to safe input voltage specification in Electrical Characteristics for clarityGo
  • Changed parameter name to Input bias current and added test condition "TA = –40°C to +85°C" to input bias current drift specification in Electrical Characteristics for clarityGo
  • Changed parameter name to Input offset current drift and added test condition "TA = –40°C to +85°C" to input offset current drift specification in Electrical Characteristics for clarityGo
  • Changed maximum gain error specification for INA128PA/UA and INA129PA/UA with G = 1 from ±0.01% to ±0.1% in Electrical Characteristics Go
  • Changed parameter name to Gain drift and added test condition "TA = –40°C to +85°C" for gain drift in Electrical Characteristics for clarityGo
  • Changed parameter names from "Voltage - Positive" to "Positive output voltage swing" and from "Voltage - Negative" to "Negative output voltage swing" in Electrical Characteristics Go
  • Deleted typical positive and negative output voltage swing specifications in Electrical Characteristics Go
  • Added test condition "Continuous to VS / 2" short-circuit current specification in Electrical Characteristics for clarityGo
  • Changed typical bandwidth specification for G = 10 from 700 kHz to 600 kHz in Electrical Characteristics Go
  • Changed typical slew rate specification from 4 V/µs to 1.2 V/µs in Electrical Characteristics Go
  • Changed typical settling time specification for G = 1, G = 10, from 7 µs to 9 µs in Electrical Characteristics Go
  • Deleted parameter "Temperature Range" as made redundant by "Recommended Operating Conditions" and "Absolute Maximum Ratings" Go
  • Changed parameter name to "Total quiescent current" and deleted redundant voltage range, operating temperature range, and specification temperature range specifications from Electrical Characteristics Go
  • Added test conditions below the Typical Characteristics titleGo
  • Changed Figure 6-1, Gain vs Frequency Go
  • Changed Figure 6-3, Positive Power Supply Rejection vs Frequency Go
  • Changed Figure 6-4, Negative Power Supply Rejection vs Frequency Go
  • Changed Figure 6-7, Crosstalk vs Frequency Go
  • Changed Figure 6-8, Input-Referred Voltage Noise vs Frequency Go
  • Changed Figure 6-9, Settling Time vs Gain Go
  • Changed Figure 6-11, Input Overvoltage V/I Characteristics Go
  • Changed Figure 6-12, Offset Voltage Warm-Up Go
  • Changed Output Voltage Swing vs Output Current, into two separate plots, one for positive (Figure 6-14) and one for negative (Figure 6-15)Go
  • Changed Figure 6-22 to Figure 6-24, Large-Signal Step Response Go