8 Revision History
Changes from Revision B (May 2023) to Revision C (January 2026)
- Added different fabrication process specifications for Input bias current in the Features sectionGo
- Added description of device flow information in the
Specifications
Go
- Added all chips site origins (CSO) condition to the typical test conditions in the Electrical CharacteristicsGo
- Added different fabrication process specifications for Offset voltage (RTI) in the Electrical Characteristics
Go
- Added different fabrication process specifications for Power-supply rejection ratio (RTI) in the Electrical Characteristics
Go
- Added different fabrication process specifications for Long-term stability in the Electrical Characteristics
Go
- Added different fabrication process specifications for Common-mode rejection ratio in the Electrical Characteristics
Go
- Added different fabrication process specifications for Input bias current in the Electrical Characteristics
Go
- Added different fabrication process specifications for Input offset current in the Electrical Characteristics
Go
- Added different fabrication process specifications for Voltage noise (RTI) in the Electrical Characteristics
Go
- Added different fabrication process specifications for Current noise in the Electrical Characteristics
Go
- Added different fabrication process specifications for Gain error in the Electrical Characteristics
Go
- Added different fabrication process specifications for Gain drift in the Electrical Characteristics
Go
- Added different fabrication process specifications for Positive output voltage in the Electrical Characteristics
Go
- Added different fabrication process specifications for Negative output voltage in the Electrical Characteristics
Go
- Added different fabrication process specifications for Short-circuit current in the Electrical Characteristics
Go
- Added different fabrication process specifications for Bandwidth, –3dB in the Electrical Characteristics
Go
- Added different fabrication process specifications for Slew rate in the Electrical CharacteristicsGo
- Added different fabrication process specifications for Settling time in the Electrical Characteristics
Go
- Added all chips site origins (CSO) condition to the typical test conditions in the Typical Characteristics
Go
- Added CSO: SHE to Common-Mode Rejection vs Frequency, Settling Time vs Gain, Quiescent Current and Slew Rate vs Temperature, Input Overvoltage V/I Characteristics, Input Bias Current vs Temperature, Output Voltage Swing vs Power Supply Voltage, Short Circuit Output Current vs Temperature, Maximum Output Voltage vs Frequency, Total Harmonic Distortion + Noise vs Frequency, and Small-Signal Step Response curves in the Typical Characteristics
Go
- Added CSO: TID to Gain vs Frequency, Positive Power Supply Rejection vs Frequency, Negative Power Supply Rejection vs Frequency, Input-Referred Voltage Noise vs Frequency, Positive Output Voltage Swing vs Output Current, Negative Output Voltage Swing vs Output Current, and Large-Signal Step Response curves in the Typical Characteristics
Go
- Added Gain vs Frequency, Positive Power Supply Rejection vs Frequency, Negative Power Supply Rejection vs Frequency, Input-Referred Noise vs Frequency, Output Voltage Swing vs Output Current, and Large-Signal Step Response curves for CSO: SHE in the Typical Characteristics
Go
- Added Common-Mode Rejection vs Frequency, Input-Referred Current Noise vs Frequency, Input Overvoltage V/I Characteristics, Input Bias Current vs Temperature, Input Offset Current vs Temperature, Maximum Output Voltage vs Frequency, Total Harmonic Distortion + Noise vs Frequency, and Small-Signal Step Response curves for CSO: TID in the Typical Characteristics
Go
- Added Part Number flow information table to the Device
Nomenclature
Go
Changes from Revision A (April 2007) to Revision B (May 2023)
- Updated the numbering format for tables, figures, and cross-references throughout the documentGo
- Added the Package Information table, and the Pin Configuration and Functions, Specifications, Detailed Description, Application and Implementation, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sectionsGo
- Added input voltage noise, high bandwidth, and temperature range bullets to Features
Go
- Changed Features bullet to show correct package nameGo
- Changed Applications bullets to show updated linksGo
- Changed Package Information table column name from BODY SIZE (NOM) to PACKAGE SIZE and added note regarding the package sizeGo
- Added single supply specification to Absolute Maximum Ratings
Go
- Added note clarifying output short-circuit to ground in Absolute Maximum Ratings refers to short-circuit to VS / 2Go
- Added single supply specification to Recommended Operating Conditions
Go
- Changed input common-mode voltage range specification from V – 2 to (V–) + 2 in Recommended Operating Conditions
Go
- Deleted INA128-HT and INA129-HT operating temperature specifications from Recommended Operating Conditions
Go
- Added specified temperature range to Recommended Operating Conditions
Go
- Added test conditions below Electrical Characteristics titleGo
- Changed test condition for offset voltage drift specification in Electrical Characteristics from "TA = TMIN to TMAX" to " TA = –40℃ to +85℃" for clarityGo
- Changed "±0.5±0/G" to "±0.5±20/G" in MAX column of Offset voltage RTI vs temperature row of Electrical Characteristics.Go
- Changed typical long-term stability specification from ±0.1±3/GµV/mo to ±0.2±3/GµV/mo in Electrical Characteristics
Go
- Deleted typical specification and changed common-mode voltage specification from (V–) + 2 V minimum and (V+) – 2 V maximum across one row in Electrical CharacteristicsGo
- Deleted typical VCM specifications in Electrical Characteristics
Go
- Added test condition of "RS = 0 Ω" to safe input voltage specification in Electrical Characteristics for clarityGo
- Changed parameter name to Input bias current and added test condition "TA = –40°C to +85°C" to input bias current drift specification in Electrical Characteristics for clarityGo
- Changed parameter name to Input offset current drift and added test condition "TA = –40°C to +85°C" to input offset current drift specification in Electrical Characteristics for clarityGo
- Changed maximum gain error specification for INA128PA/UA and INA129PA/UA with G = 1 from ±0.01% to ±0.1% in Electrical Characteristics
Go
- Changed parameter name to Gain drift and added test condition "TA = –40°C to +85°C" for gain drift in Electrical Characteristics for clarityGo
- Changed parameter names from "Voltage - Positive" to "Positive output voltage swing" and from "Voltage - Negative" to "Negative output voltage swing" in Electrical Characteristics
Go
- Deleted typical positive and negative output voltage swing specifications in Electrical Characteristics
Go
- Added test condition "Continuous to VS / 2" short-circuit current specification in Electrical Characteristics for clarityGo
- Changed typical bandwidth specification for G = 10 from 700 kHz to 600 kHz in Electrical Characteristics
Go
- Changed typical slew rate specification from 4 V/µs to 1.2 V/µs in Electrical Characteristics
Go
- Changed typical settling time specification for G = 1, G = 10, from 7 µs to 9 µs in Electrical Characteristics
Go
- Deleted parameter "Temperature Range" as made redundant by "Recommended Operating Conditions" and "Absolute Maximum Ratings"
Go
- Changed parameter name to "Total quiescent current" and deleted redundant voltage range, operating temperature range, and specification temperature range specifications from Electrical Characteristics
Go
- Added test conditions below the Typical Characteristics titleGo
- Changed Figure 6-1, Gain vs Frequency
Go
- Changed Figure 6-3, Positive Power Supply Rejection vs Frequency
Go
- Changed Figure 6-4, Negative Power Supply Rejection vs Frequency
Go
- Changed Figure 6-7, Crosstalk vs Frequency
Go
- Changed Figure 6-8, Input-Referred Voltage Noise vs Frequency
Go
- Changed Figure 6-9, Settling Time vs Gain
Go
- Changed Figure 6-11, Input Overvoltage V/I Characteristics
Go
- Changed Figure 6-12, Offset Voltage Warm-Up
Go
- Changed Output Voltage Swing vs Output Current, into two separate plots, one for positive (Figure 6-14) and one for negative (Figure 6-15)Go
- Changed Figure 6-22 to Figure 6-24, Large-Signal Step Response
Go