SBOS051G October   1995  – January 2026 INA128 , INA129

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Noise Performance
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Input Common-Mode Range
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Setting the Gain
        2. 8.2.2.2 Dynamic Performance
        3. 8.2.2.3 Offset Trimming
        4. 8.2.2.4 Input Bias Current Return Path
      3. 8.2.3 Application Curves
    3. 8.3 System Examples
    4. 8.4 Power Supply Recommendations
      1. 8.4.1 Low-Voltage Operation
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Device Nomenclature
      2. 9.1.2 Development Support
        1. 9.1.2.1 PSpice® for TI
        2. 9.1.2.2 TINA-TI™ Simulation Software (Free Download)
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

9.1.1 Device Nomenclature

Table 9-1 Device Nomenclature
PART NUMBERDEFINITION

INA12xU

INA12xU/2K5

INA12xU/2K51G4

INA12xUA

INA12xUA/2K5

The die is manufactured in CSO: SHE or CSO: FRE.

INA12xP

INA12xPA

The die is manufactured in CSO: SHE.