SBOS109B September   1999  – December 2025 INA146

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Amplifier A1, A2 Performance
    7. 5.7 Typical Characteristics
  7. 6 Application and Implementation
    1. 6.1 Application Information
      1. 6.1.1 Operating Voltage
      2. 6.1.2 Setting the Gain
      3. 6.1.3 Common-mode Range
      4. 6.1.4 Offset Trim
      5. 6.1.5 Input Impedance
  8. 7 Device and Documentation Support
    1. 7.1 Device Support
      1. 7.1.1 Device Nomenclature
    2. 7.2 Third-Party Products Disclaimer
    3. 7.3 Documentation Support
      1. 7.3.1 Related Documentation
    4. 7.4 Receiving Notification of Documentation Updates
    5. 7.5 Support Resources
    6. 7.6 Trademarks
    7. 7.7 Electrostatic Discharge Caution
    8. 7.8 Glossary
  9. 8 Revision History
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

5 Specifications

Note:

TI has qualified multiple fabrication flows for this device. Differences in performance are labeled by chip site origin (CSO). For system robustness, designing for all flows is highly recommended. For more information, please see Section 7.1.1.