SBOS600F July   2018  – July 2026 REF20

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Solder Heat Shift
    2. 7.2 Long-Term Stability
    3. 7.3 Thermal Hysteresis
    4. 7.4 Noise Performance
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 VREF and VBIAS Tracking
      2. 8.3.2 Low Temperature Drift
      3. 8.3.3 Load Current
    4. 8.4 Device Functional Modes
  10. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Low-Side, Current-Sensing Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Shunt Resistor
          2. 9.2.1.2.2 Differential Amplifier
          3. 9.2.1.2.3 Voltage Reference
          4. 9.2.1.2.4 Results
        3. 9.2.1.3 Application Curves
    3. 9.3 Power-Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Revision History

Changes from Revision E (January 2022) to Revision F (June 2026)

  • Moved REF2025, REF2030, REF2033, REF2041 devices to the REF20 product folder on TI.com and updated the datasheet headerGo
  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo

Changes from Revision D (May 2018) to Revision E (January 2022)

  • Updated Applications sectionGo
  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Changed ESD Rating table: changed HBM rating from ±4000V to ±2500VGo
  • Updated Long-term stability valueGo
  • Added Long-Term Stability sub-section under Parameter Measurement Information sectionGo