SBOS974F August   2019  – December 2024 THS6222

PRODUCTION DATA  

1.   1
2. 1 Features
3. 2 Applications
4. 3 Description
5. 4 Pin Configuration and Functions
6. 5 Specifications
   1. 5.1 Absolute Maximum Ratings
   2. 5.2 ESD Ratings
   3. 5.3 Recommended Operating Conditions
   4. 5.4 Thermal Information
   5. 5.5 Electrical Characteristics VS = 12 V
   6. 5.6 Electrical Characteristics VS = 32 V
   7. 5.7 Timing Requirements
   8. 5.8 Typical Characteristics: VS = 12 V
   9. 5.9 Typical Characteristics: VS = 32 V
7. 6 Detailed Description
   1. 6.1 Overview
   2. 6.2 Functional Block Diagram
   3. 6.3 Feature Description
      1. 6.3.1 Common-Mode Buffer
      2. 6.3.2 Thermal Protection and Package Power Dissipation
      3. 6.3.3 Output Voltage and Current Drive
      4. 6.3.4 Breakdown Supply Voltage
      5. 6.3.5 Surge Test Results
   4. 6.4 Device Functional Modes
8. 7 Application and Implementation
   1. 7.1 Application Information
   2. 7.2 Typical Applications
      1. 7.2.1 Broadband PLC Line Driving
         1. 7.2.1.1 Design Requirements
         2. 7.2.1.2 Detailed Design Procedure
         3. 7.2.1.3 Application Curve
   3. 7.3 Best Design Practices
      1. 7.3.1 Do
      2. 7.3.2 Do Not
   4. 7.4 Power Supply Recommendations
   5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
         1. 7.5.1.1 Wafer and Die Information
      2. 7.5.2 Layout Examples
9. 8 Device and Documentation Support
   1. 8.1 Development Support
   2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
   3. 8.3 Receiving Notification of Documentation Updates
   4. 8.4 Support Resources
   5. 8.5 Trademarks
   6. 8.6 Electrostatic Discharge Caution
   7. 8.7 Glossary
10. 9 Revision History
11. 10Mechanical, Packaging, and Orderable Information