SBOSAJ9 June   2026 TMCS1170

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Insulation Specifications
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Accuracy Parameters
      1. 7.1.1 Sensitivity Error
      2. 7.1.2 Offset Error
      3. 7.1.3 Nonlinearity Error
      4. 7.1.4 Power Supply Rejection Ratio
      5. 7.1.5 Common-Mode Rejection Ratio
      6. 7.1.6 External Magnetic Field Errors
    2. 7.2 Transient Response Parameters
      1. 7.2.1 CMTI, Common-Mode Transient Immunity
    3. 7.3 Safe Operating Area
      1. 7.3.1 Continuous DC or Sinusoidal AC Current
      2. 7.3.2 Repetitive Pulsed Current SOA
      3. 7.3.3 Single Event Current Capability
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Current Input
      2. 8.3.2 Input Isolation
      3. 8.3.3 Ambient Field Rejection
      4. 8.3.4 Internal Reference Voltage
      5. 8.3.5 Current-Sensing Measurable Ranges
      6. 8.3.6 Overcurrent Detection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Down Behavior
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1.     PACKAGE OPTION ADDENDUM
    2. 12.1 Tape and Reel Information
    3. 12.2 Mechanical Data

6.7 Typical Characteristics

TMCS1170 Sensitivity Error vs Temperature
Figure 6-1 Sensitivity Error vs Temperature
TMCS1170 Non-Linearity vs Temperature
Figure 6-3 Non-Linearity vs Temperature
TMCS1170 Offset Error Production Distribution
Figure 6-5 Offset Error Production Distribution
TMCS1170 Phase vs Frequency, All Sensitivities
Figure 6-7 Phase vs Frequency, All Sensitivities
TMCS1170 Output Swing vs Output Current
Figure 6-9 Output Swing vs Output Current
TMCS1170 Output Impedance vs Frequency
Figure 6-11 Output Impedance vs Frequency
TMCS1170 Input-Referred Noise vs Frequency
All sensitivities
Figure 6-13 Input-Referred Noise vs Frequency
TMCS1170 Voltage Output Step Response, Falling
Figure 6-15 Voltage Output Step Response, Falling
TMCS1170 Startup Transient Response
Figure 6-17 Startup Transient Response
TMCS1170 Offset Error vs Temperature
Figure 6-2 Offset Error vs Temperature
TMCS1170 Sensitivity Error Production Distribution
All sensitivities
Figure 6-4 Sensitivity Error Production Distribution
TMCS1170 Sensitivity vs Frequency, All Sensitivities Normalized to 1Hz
Figure 6-6 Sensitivity vs Frequency, All Sensitivities Normalized to 1Hz
TMCS1170 PSRR vs Frequency
Figure 6-8 PSRR vs Frequency
TMCS1170 Output Swing vs Output Current
Figure 6-10 Output Swing vs Output Current
TMCS1170 Quiescent Current vs Temperature
Figure 6-12 Quiescent Current vs Temperature
TMCS1170 Voltage Output Step Response, Rising
Figure 6-14 Voltage Output Step Response, Rising
TMCS1170 Current Overload Response
Figure 6-16 Current Overload Response
TMCS1170 Input Conductor Resistance vs Temperature
Figure 6-18 Input Conductor Resistance vs Temperature