SBVA105 April   2025 TPS74801

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2Simulation and Measurement Results
    1. 2.1 Measurements
  6. 3Summary
  7. 4References

Abstract

This application note covers a thermal exploration into the decreasing LDO die and package size of Texas Instruments low-dropout regulators (LDO). Additionally, an overview on thermal resistance, FET description and design, as well as LDO thermal performance are provided. This application note covers thermal resistance results of transitioning from a 2.68mm2 die size to a 0.75mm2 die size, otherwise viewed as a 72% decrease in die area.