SBVS154A March   2012  – June 2025 TPS79633-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagrams
    3. 6.3 Feature Description
      1. 6.3.1 Undervoltage Lockout (UVLO)
      2. 6.3.2 Shutdown
      3. 6.3.3 Active Discharge (New Chip)
      4. 6.3.4 Thermal Protection
      5. 6.3.5 Regulator Protection
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout Operation
      3. 6.4.3 Disabled
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Exiting Dropout
      2. 7.1.2 External Capacitor Requirements
      3. 7.1.3 Board Layout Recommendation to Improve PSRR and Noise Performance
      4. 7.1.4 Regulator Mounting
      5. 7.1.5 Thermal Information
        1. 7.1.5.1 Power Dissipation
        2. 7.1.5.2 Estimating Junction Temperature
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Examples
  9. 8 Device and Documentation Support
    1. 8.1 Device Nomenclature
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

9 Revision History

Changes from Revision * (March 2012) to Revision A (June 2025)

  • Added device name and Automotive to document titleGo
  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Added Device Information, ESD Ratings, Application and Implementation, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sectionsGo
  • Changed entire document to align with current family format and to identify the features and differences of the legacy chip and new chip Go
  • Added new silicon (M3) devices to documentGo
  • Changed TPS796xx-Q1 to TPS796-Q1 and terminal to pin throughout documentGo
  • Changed automotive-specific Features bulletsGo
  • Changed Applications sectionGo
  • Changed Terminal Functions title to Pin Configuration and Functions and added Type column to Pin Functions tableGo
  • Added NC pin description to pin 5 for new chipGo
  • Added new silicon curves to Typical Characteristics sectionGo
  • Added new silicon block diagrams to Functional Block Diagrams sectionGo
  • Deleted reference to DRB packageGo
  • Added Device Nomenclature sectionGo