SCAS289O January   1993  – July 2025 SN74LVC112A

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Requirements, –40°C to +85°C
    7. 5.7  Timing Requirements, –40°C to +125°C
    8. 5.8  Switching Characteristics, –40°C to +85°C
    9. 5.9  Switching Characteristics, –40°C to +125°C
    10. 5.10 Operating Characteristics
    11. 5.11 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) SN74LVC112A UNIT
D
(SOIC)		 DB
(SSOP)		 DGV
(TVSOP)		 NS
(SOP)		 PW
(TSSOP)
16 PINS 16 PINS 16 PINS 16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 118.1 122.5 129.0 117.5 141.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 81.6 75.2 52.1 76 51.4
RθJB Junction-to-board thermal resistance 80 85.5 62.0 84.2 64.4
ψJT Junction-to-top characterization parameter 36.3 30.5 6.5 34.2 6.7
ψJB Junction-to-board characterization parameter 79.2 84.1 61.3 83.1 63.8
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A N/A N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953