SCAS297O January   1993  – June 2026 SN74LVC540A

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5.   5
  6. 4 Pin Configuration and Functions
  7. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics, SN74LVC540A
    7. 5.7 Operating Characteristics
    8. 5.8 Typical Characteristics
  8. 6 Parameter Measurement Information
    1. 6.1 17
  9.   18
  10. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced CMOS 3-State Outputs
      2. 7.3.2 Partial Power Down (Ioff)
      3. 7.3.3 Standard CMOS Inputs
      4. 7.3.4 Clamp Diode Structure
    4. 7.4 Device Functional Modes
  11. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  12. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  13. 10Revision History
  14. 11Mechanical, Packaging, and Orderable Information

10 Revision History

Changes from May 1, 2014 to June 25, 2026 (from Revision N (May 2014) to Revision O (June 2026))

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Moved ESD ratings to ESD Ratings tableGo
  • Updated latch-up ratings to latest standardsGo
  • Deleted military disclaimersGo
  • Updated Device Information format and included package sizeGo
  • Updated Simplified Schematic Go
  • Updated Applications Go
  • Added DGS and RKS package informationGo
  • Added DGS and RKS packages to Thermal Information table.Go
  • Changed RθJA for DW package from: 88.3°C/W to: 114.8°C/WGo
  • Changed RθJC(top) for DW package from: 51.1°C/W to: 84.1°C/WGo
  • Changed ΨJT for DW package from: 50.9°C/W to: 88.8°C/WGo
  • Changed ΨJB for DW package from: 20°C/W to: 55.8°C/WGo
  • Changed RθJC(bot) for DW package from: 50.5°C/W to: 87.8°C/WGo
  • Changed RθJA for PW package from: 102.5°C/W to: 120.3°C/WGo
  • Changed RθJC(top) for PW package from: 35.9°C/W to: 62.5°C/WGo
  • Changed ΨJT for PW package from: 53.5°C/W to: 82.4°C/WGo
  • Changed ΨJB for PW package from: 2.2°C/W to: 16°C/WGo
  • Changed RθJC(bot) for PW package from: 52.9°C/W to: 81.5°C/WGo
  • Added parallel trace spacing recommendation to layout guidelines. Changed wording of "Avoid branches; buffer signals that must branch separately" to "Avoid branches; buffer each signal that must branch separately"Go

Changes from Revision M (May 2005) to Revision N (May 2014)

  • Updated document to new data sheet standardsGo
  • Deleted Ordering Information tableGo
  • Added Military D disclaimer to Features listGo
  • Added Device Information table.Go
  • Changed MAX ambient temperature to 125°C.Go
  • Added Thermal Information table.Go
  • Added Typical Characteristics. Go
  • Added ESD warning.Go
  • Added Mechanical, Packaging, and Orderable Information.Go