SCAS763D February 2004 – October 2024 SN74LVC126A-Q1
PRODUCTION DATA
Figure 3-1 SN74LVC126A-Q1
D or PW Package;14-Pin SOIC or TSSOP
(Top View)
Figure 3-2 SN74LVC126A-Q1
BQA Package;14-Pin WQFN (Top View)| PIN | I/O(1) | DESCRIPTION | |
|---|---|---|---|
| NO. | NAME | ||
| 1 | 1OE | I | Output enable 1 |
| 2 | 1A | I | Gate 1 input |
| 3 | 1Y | O | Gate 1 output |
| 4 | 2OE | I | Output enable 2 |
| 5 | 2A | I | Gate 2 input |
| 6 | 2Y | O | Gate 2 output |
| 7 | GND | — | Ground pin |
| 8 | 3Y | O | Gate 3 output |
| 9 | 3A | I | Gate 3 input |
| 10 | 3OE | I | Output enable 3 |
| 11 | 4Y | O | Gate 4 output |
| 12 | 4A | I | Gate 4 input |
| 13 | 4OE | I | Output Enable 4 |
| 14 | VCC | — | Power pin |
| Thermal pad | — | Connect the GND pin to the exposed thermal pad for correct operation. Connect the thermal pad to any internal PCB ground plane using multiple vias for good thermal performance. | |