SCASE16A September   2024  – June 2025 SN74AC2G100

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Characteristics
    7. 5.7 Switching Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced CMOS Push-Pull Outputs
      2. 7.3.2 CMOS Schmitt-Trigger Inputs
      3. 7.3.3 Latching Logic
      4. 7.3.4 Clamp Diode Structure
    4. 7.4 Device Functional Modes
    5. 7.5 Combinatorial Logic Configurations
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
      2. 8.2.2 Detailed Design Procedure
    3. 8.3 Application Curves
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

4 Pin Configuration and Functions

SN74AC2G100 BQB Package,16-Pin WQFN(Top View)Figure 4-1 BQB Package,16-Pin WQFN(Top View)
SN74AC2G100 PW Package,16-Pin TSSOP(Top View)Figure 4-2 PW Package,16-Pin TSSOP(Top View)
Table 4-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
CLR1 1 I Clear for Channel 1, active low
DA1 2 I Channel 1, Data input A
DB1 3 I Channel 1, Data input B
DC1 4 I Channel 1, Data input C
DD1 5 I Channel 1, Data input D
Q1 6 O Channel 1, Output Q
CLK1 7 I Clock for Channel 1, rising edge triggered
GND 8 G Ground
CLK2 9 I Clock for Channel 2, rising edge triggered
Q2 10 O Channel 2, Output Q
DD2 11 I Channel 2, Data input D
DC2 12 I Channel 2, Data input C
DB2 13 I Channel 2, Data input B
DA2 14 I Channel 2, Data input A
CLR2 15 I Clear for Channel 2, active low
VCC 16 P Positive Supply
Thermal Pad(2) — The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply.
(1) I = Input, O = Output, I/O = Input or Output, G = Ground, P = Power.
(2) BQB package only