SCDS114E December   2002  – September 2026 SN74CB3Q3384A

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Description
  4. 3Pin Configuration and Functions
  5. 4Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 ESD Ratings
    3. 4.3 Recommended Operating Conditions
    4. 4.4 Thermal Information
    5. 4.5 Electrical Characteristics
    6. 4.6 Switching Characteristics
  6. 5Parameter Measurement Information
  7. 6Device and Documentation Support
    1. 6.1 Documentation Support
    2. 6.2 Receiving Notification of Documentation Updates
    3. 6.3 Support Resources
    4. 6.4 Trademarks
    5. 6.5 Electrostatic Discharge Caution
    6. 6.6 Glossary
  8. 7Revision History
  9. 8Mechanical, Packaging, and Orderable Information

4.4 Thermal Information

THERMAL METRIC(1) SN74CB3Q3384A UNIT
DBQ (QSOP) DGV (TVSOP) PW (TSSOP)
24 PINS 24 PINS 24 PINS
RθJA Junction-to-ambient thermal resistance

83.7

86

93.4

 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application note.