SCDS255G December   2008  – October 2024 TS3USB30E

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Dynamic Electrical Characteristics
    7. 5.7 Switching Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

10 Revision History

Changes from Revision F (August 2015) to Revision G (October 2024)

  • Changed the Pin Configuration images and removed the RSW bottom view pinoutGo
  • Removed footnote in Absolute Maximum Ratings which stated "The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed."Go
  • Changed XTALK from -54dB to -32dB.Go
  • Changed OISO from -40dB to -32dBGo
  • Changed BW from 900MHz to 1400GHz and removed CL = 5pF from Test Conditions.Go
  • Changed the Gain vs Frequency graphGo
  • Changed the Crosstalk (XTALK) graphGo
  • Changed the Off Isolation (OISO) graphGo
  • Removed the 50Ω pulldown resistor on VOUT1 from the Off Isolation (OISO) imageGo
  • Added the text D next to VIN the Crosstalk (XTALK) imageGo

Changes from Revision E (August 2012) to Revision F (August 2015)

  • Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Changed package type in the Description From: DGS To: VSSOP Go