SCDS348D September   2013  – August 2024 TS3USB3031

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Dynamic Characteristics
    7. 5.7 Typical Characteristics
  7.   Parameter Measurement Information
  8. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 IOFF Protection
      2. 6.3.2 1.8-V Compatible Logic
      3. 6.3.3 Overvoltage Tolerant (OVT)
    4. 6.4 Device Functional Modes
  9. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
        1. 7.2.3.1 MHL Eye Pattern
        2. 7.2.3.2 USB EYE Pattern
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  10. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  11. 9 Revision History
  12. 10Mechanical, Packaging, and Orderable Information

4 Pin Configuration and Functions

TS3USB3031 RMG Package, 12-Pin VQFN (Top View)Figure 4-1 RMG Package, 12-Pin VQFN (Top View)
TS3USB3031 RMG Package, 12-Pin VQFN (Bottom View)Figure 4-2 RMG Package, 12-Pin VQFN (Bottom View)
Table 4-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
SEL0 1 I Digital control Input
SEL1 2 I Digital control Input
USB1+ 3 I/O Differential signal path 1
USB1– 4 I/O Differential signal path 1
USB2+ 5 I/O Differential signal path 2
USB2– 6 I/O Differential signal path 2
MHL+ 7 I/O Differential signal path 3
MHL– 8 I/O Differential signal path 3
GND 9 G Ground
D– 10 I/O Common Differential signal path
D+ 11 I/O Common Differential signal path
VCC 12 P Power Supply
(1) G = Ground, I = Input, O = Output, P = Power