SCDS383F August   2018  – July 2025 TMUX6111 , TMUX6112 , TMUX6113

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Thermal Information
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Electrical Characteristics (Dual Supplies: ±15V)
    6. 6.6 Switching Characteristics (Dual Supplies: ±15V)
    7. 6.7 Electrical Characteristics (Single Supply: 12V)
    8. 6.8 Switching Characteristics (Single Supply: 12V)
    9. 6.9 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Truth Tables
  9. 8 Detailed Description
    1. 8.1 Overview
      1. 8.1.1  On-Resistance
      2. 8.1.2  Off-Leakage Current
      3. 8.1.3  On-Leakage Current
      4. 8.1.4  Break-Before-Make Delay
      5. 8.1.5  Turn-On and Turn-Off Time
      6. 8.1.6  Charge Injection
      7. 8.1.7  Off Isolation
      8. 8.1.8  Channel-to-Channel Crosstalk
      9. 8.1.9  Bandwidth
      10. 8.1.10 THD + Noise
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Ultra-low Leakage Current
      2. 8.3.2 Ultra-low Charge Injection
      3. 8.3.3 Bidirectional and Rail-to-Rail Operation
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

9.4.1 Layout Guidelines

Figure 9-4 illustrates an example of a PCB layout with the TMUX6112PW. Some key considerations are:

  • Decouple the VDD and VSS pins with a 0.1µF capacitor, placed as close to the pin as possible. Make sure that the capacitor voltage rating is sufficient for the VDD and VSS supplies.
  • Keep the input lines as short as possible.
  • Use a solid ground plane to help distribute heat and reduce electromagnetic interference (EMI) noise pickup.
  • Do not run sensitive analog traces in parallel with digital traces. Avoid crossing digital and analog traces if possible, and only make perpendicular crossings when necessary.