SCES296AG February   2000  – October 2025 SN74LVC1G07

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics, –40°C to 85°C
    7. 5.7 Switching Characteristics, –40°C to 125°C
    8. 5.8 Operating Characteristics
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 (Open Drain)
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

10 Revision History

Changes from Revision AF (June 2025) to Revision AG (October 2025)

  • Changed Junction-to-ambient thermal resistance value for DCK package from: 278°C/W to: 371.0°C/W Go
  • Changed Junction-to-case (top) thermal resistance value for DCK package from: 93°C/W to: 297.5°C/W Go
  • Changed Junction-to-board thermal resistance value for DCK package from: 65°C/W to: 258.6°C/W Go
  • Changed Junction-to-top characterization value for DCK package from: 2°C/W to: 195.6°C/WGo
  • Changed Junction-to-board characterization value for DCK package from: 64°C/W to: 256.2°C/WGo

Changes from Revision AE (September 2020) to Revision AF (June 2025)

  • Changed Device Information table to Package Information Go
  • Changed Junction-to-ambient thermal resistance value for DBV package from: 229°C/W to: 357.1°C/W Go
  • Changed Junction-to-case (top) thermal resistance value for DBV package from: 164°C/W to: 263.7°C/W Go
  • Changed Junction-to-board thermal resistance value for DBV package from: 62°C/W to: 264.4°C/W Go
  • Changed Junction-to-top characterization value for DBV package from: 44°C/W to: 195.6°C/WGo
  • Changed Junction-to-board characterization value for DBV package from: 62°C/W to: 262.2°C/WGo

Changes from Revision AD (May 2016) to Revision AE (September 2020)

  • Updated the numbering format for tables, figures, and cross-references throughout the document.Go