SCES481E August   2003  – August 2024 SN74LVC74A-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Description
  4. 3 Pin Configuration and Functions
  5. 4 Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 ESD Ratings
    3. 4.3 Recommended Operating Conditions
    4. 4.4 Thermal Information
    5. 4.5 Electrical Characteristics
    6. 4.6 Timing Requirements
    7. 4.7 Switching Characteristics
    8. 4.8 Operating Characteristics
  6. 5 Parameter Measurement Information
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Power Supply Recommendations
    2. 7.2 Layout
      1. 7.2.1 Layout Guidelines
      2. 7.2.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support (Analog)
      1. 8.1.1 Related Links
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

3 Pin Configuration and Functions

SN74LVC74A-Q1 D or PW Package, 14-Pin SOIC or TSSOP(Top View)Figure 3-1 D or PW Package, 14-Pin SOIC or TSSOP(Top View)
SN74LVC74A-Q1 BQA Package14-Pin WQFN With Exposed Thermal Pad(Top View)Figure 3-2 BQA Package14-Pin WQFN With Exposed Thermal Pad(Top View)
Table 3-1 Pin Functions
PIN I/O(1) DESCRIPTION
NAME SOIC, TSSOP, VQFN
1CLK 3 I Channel 1 clock input
1 CLR 1 I Channel 1 clear input. Pull low to set Q output low.
1D 2 I Channel 1 data input
1 PRE 4 I Channel 1 preset input. Pull low to set Q output high.
1Q 5 O Channel 1 output
1 Q 6 O Channel 1 inverted output
2CLK 11 I Channel 2 clock input
2 CLR 13 I Channel 2 clear input. Pull low to set Q output low.
2D 12 I Channel 2 data input
2 PRE 10 I Channel 2 preset input. Pull low to set Q output high.
2Q 9 O Channel 2 output
2 Q 8 O Channel 2 Inverted output
GND 7 — Ground
NC — — No connect
VCC 14 — Supply
Thermal pad — Connect the GND pin to the exposed thermal pad for correct operation. Connect the thermal pad to any internal PCB ground plane using multiple vias for good thermal performance.
(1) I = input, O = output, P = power, FB = feedback, GND = ground, N/A = not applicable