SCES482F August   2003  – October 2025 SN74LVC1G04-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Switching Characteristics
    8. 5.8 Operating Characteristics
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
  8.   17
  9. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  10. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  11. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1.      Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  12. 10Revision History
  13. 11Mechanical, Packaging, and Orderable Information

10 Revision History

Changes from Revision E (June 2025) to Revision F (October 2025)

  • Changed Junction-to-ambient thermal resistance value for DCK package from: 278°C/W to: 371.0°C/W Go
  • Changed Junction-to-case (top) thermal resistance value for DCK package from: 93°C/W to: 297.5°C/W Go
  • Changed Junction-to-board thermal resistance value for DCK package from: 65°C/W to: 258.6°C/W Go
  • Changed Junction-to-top characterization value for DCK package from: 2°C/W to: 195.6°C/W Go
  • Changed Junction-to-board characterization value for DCK package from: 64°C/W to: 256.2°C/W Go

Changes from Revision D (January 2013) to Revision E (June 2025)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Deleted Ordering Information from the front page. See the orderable addendum at the end of the data sheet Go
  • Added package sizes to the Device Information tableGo
  • Added ESD Ratings table Go
  • Added Thermal Information tableGo
  • Changed Junction-to-ambient thermal resistance value for DBV package from: 206°C/W to: 357.1°C/W Go
  • Changed Junction-to-ambient thermal resistance value for DCK package from: 252°C/W to: 278°C/W Go
  • Added Application and Implementation section. Go
  • Added Power Supply Recommendations section. Go
  • Added Layout section. Go

Changes from Revision C (April 2008) to Revision D (January 2013)

  • Added new list item in Features, second one with sub list itemsGo