10 Revision History
Changes from Revision D (April 2025) to Revision E (October 2025)
- Changed Junction-to-ambient thermal resistance value for DCK package
from: 258°C/W to: 371.0°C/W Go
- Changed Junction-to-case (top) thermal resistance value for DCK
package from: 66°C/W to: 297.5°C/WGo
- Changed Junction-to-board thermal resistance value for DCK package
from: 67°C/W to: 258.6°C/WGo
- Changed Junction-to-top characterization value for DCK package from:
2°C/W to: 195.6°C/WGo
- Changed Junction-to-board characterization value for DCK package
from: 66°C/W to: 256.2°C/WGo
Changes from Revision C (August 2021) to Revision D (April 2025)
- Added DBV package to Package Information table, Pin
Configuration and Functions section, and Thermal Information
tableGo