SCES885A April   2017  – August 2026 SN74LVC1G80-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Requirements: TA = –40°C to +85°C
    7. 5.7  Timing Requirements: TA = –40°C to +125°C
    8. 5.8  Switching Characteristics: TA = –40°C to +85°C, CL = 15pF
    9. 5.9  Switching Characteristics: TA = –40°C to +85°C, CL = 30pF or 50pF
    10. 5.10 Switching Characteristics: TA = –40°C to +125°C, CL = 30pF or 50pF
    11. 5.11 Operating Characteristics
    12. 5.12 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced High-Drive CMOS Push-Pull Outputs
      2. 7.3.2 Standard CMOS Inputs
      3. 7.3.3 Clamp Diodes
      4. 7.3.4 Partial Power Down (Ioff)
      5. 7.3.5 Over-Voltage Tolerant Inputs
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

7.3.1 Balanced High-Drive CMOS Push-Pull Outputs

A balanced output allows the device to sink and source similar currents. The high drive capability of this device creates fast edges into light loads so routing and load conditions must be considered to prevent ringing. Additionally, the outputs of this device are capable of driving larger currents than the device can sustain without being damaged. Limit the tower output of the device to avoid thermal runaway and damage due to over-current. The electrical and thermal limits defined the in the Section 5.1 must be followed at all times.