SCHS334C March   2003  – April 2025 CD54AC153 , CD74AC153

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Description
  4. 3 Pin Configuration and Functions
  5. 4 Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 ESD Ratings
    3. 4.3 Recommended Operating Conditions
    4. 4.4 Thermal Information
    5. 4.5 Electrical Characteristics
    6. 4.6 Switching Characteristics, VCC = 1.5 V
    7. 4.7 Switching Characteristics, VCC = 3.3 V ± 0.3 V
    8. 4.8 Switching Characteristics, VCC = 5 V ± 0.5 V
    9. 4.9 Operating Characteristics
  6. 5 Parameter Measurement Information
  7. 6 Detailed Description
    1. 6.1 Functional Block Diagram
    2. 6.2 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Power Supply Recommendations
    2. 7.2 Layout
      1. 7.2.1 Layout Guidelines
      2. 7.2.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

4.4 Thermal Information

THERMAL METRIC(1) D (SOIC) N (PDIP) PW (TSSOP) BQB (WQFN) UNIT
16 PINS 16 PINS 16 PINS 16 PINS
R θJA Junction-to-ambient thermal resistance 119.9 67 139.5 98.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance — — 74.8 94.6 °C/W
RθJB Junction-to-board thermal resistance — — 97.7 67.7 °C/W
ΨJT Junction-to-top characterization parameter — — 17.8 15.6 °C/W
ΨJB Junction-to-board characterization parameter — — 96.6 67.5 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance — — — 45.9 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application note.