SCLS085L December   1982  – February 2025 SN54HC14 , SN54HC14-SP , SN74HC14

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1.     6
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics - 74
    6. 5.6  Electrical Characteristics - 54
    7. 5.7  Switching Characteristics - 74
    8. 5.8  Switching Characteristics - 54
    9. 5.9  Operating Characteristics
    10. 5.10 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced CMOS Push-Pull Outputs
      2. 7.3.2 CMOS Schmitt-Trigger Inputs
      3. 7.3.3 Clamp Diode Structure
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

10 Revision History

Changes from Revision K (June 2021) to Revision L (July 2024)

  • Added package sizes to Device Information tableGo
  • Updated thermal values for N package from ΨJB = 40.3 to 40.5, all values in °C/W Go

Changes from Revision J (October 2016) to Revision K (June 2021)

  • Updated the numbering format for tables, figures and cross-references throughout the documentGo
  • Updated to new data sheet standardsGo
  • Updated package sizing for DB package in Device Information tableGo
  • Increased D (86 to 133.6), DB (96 to 114.8), NS (76 to 122.6), and PW (113 to 151.7); decreased N (80 to 60.7) °C/WGo