SCPS295C September   2024  – April 2026 TPLD801

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Supply Current Characteristics
    7. 5.7 Switching Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 I/O Pins
        1. 7.3.1.1 Input Modes
        2. 7.3.1.2 Output Modes
        3. 7.3.1.3 Pull-Up or Pull-Down Resistors
      2. 7.3.2 Connection Mux
      3. 7.3.3 Configurable Use Logic Blocks
        1. 7.3.3.1 2-Bit LUT macro-cell
        2. 7.3.3.2 3-Bit LUT Macro-Cell
        3. 7.3.3.3 2-Bit LUT or D Flip-Flop/Latch Macro-Cell
        4. 7.3.3.4 3-Bit LUT or D Flip-Flop/Latch with Set/Reset Macro-Cell
        5. 7.3.3.5 3-Bit LUT or Pipe Delay Macro-Cell
        6. 7.3.3.6 4-Bit LUT or 8-Bit Counter/Delay Macro-Cell
      4. 7.3.4 8-Bit Counters and Delay Generators (CNT/DLY)
        1. 7.3.4.1 Delay Mode
        2. 7.3.4.2 Edge Detector Mode
        3. 7.3.4.3 Reset Counter Mode
      5. 7.3.5 Programmable Deglitch Filter or Edge Detector Macro-Cell
      6. 7.3.6 Selectable Frequency Oscillator
        1. 7.3.6.1 Oscillator Power Modes
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-On Reset
        1. 7.4.1.1 GPIO Quick Charge
        2. 7.4.1.2 Initialization
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

8.2.2 Detailed Design Procedure

  1. Add a decoupling capacitor from VCC to GND. The capacitor needs to be placed physically close to the device and electrically close to both the VCC and GND pins. An example layout is shown in the Layout section.
  2. Verify that the capacitive load at the output is ≤ 50pF. Low load capacitance can be accomplished by providing short, appropriately sized traces from the TPLD801 to the receiving device.
  3. Verify that the resistive load at the output is larger than (VCC / IO(max))Ω. Never violate the maximum output current from the Absolute Maximum Ratings. Most CMOS inputs have a resistive load measured in MΩ; much larger than the minimum calculated previously.
  4. Thermal issues are rarely a concern for logic gates; however, the power consumption and thermal increase can be calculated using the steps provided in the CMOS Power Consumption and Cpd Calculation application note.