SDAA013 September   2025 BQ25190

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2Schematic Design Guide
    1. 2.1 BQ25190 Schematic
  6. 3Layout Design Guide
  7. 4PCB Layer Plots
  8. 5Summary
  9. 6References

Schematic Design Guide

For the BQ25190, optimizing for space means minimizing component counts, identifying unused pins, alternate connection paths, and selecting the smallest valid components.

The device offers four GPIOs, each with various functions accessible via register programmability. Pins GPIO3 and GPIO4, by default, are used in determining default buck output voltage. The voltage is dependent on GPIO3 and GPIO4 being pulled high, or low, to select one of four default voltages:

GPIO3 Low

GPIO3 High

GPIO4 Low

1.8V Default Vbuck 3.3V Default Vbuck

GPIO4 High

2.5V Default Vbuck

1.2V Default Vbuck

For configurability these signals are typically routed out to a pull-up or pull-down resistors. By selecting the best default voltage and directly tying these pins to either GND or SYS, the need for pull-up or pull-down resistors is eliminated.

Component selection can be optimized for space at the cost of some application performance limitations. The table below demonstrates a comparison of component selection between the EVM and the small solution size, as well as a size comparison:

Component

EVM Component Small Form Factor Component
CIN 10uF | 35V | 0603 22uF | 10V | 0402
CVINLS (1 and 2) 2.2uF | 6.3V | 0402 None
IBB 2.2uH | 1.7A | 0.14Ω | 0805 2.2uH | 1.05A | 0.25Ω | 0603
IBK 1uH | 2.7A | 0.056Ω | 0805 1uH | 1.6A | 0.114Ω | 0603

These component selections do have impact on performance, but the total solution size is improved. CIN has a reduced capacitance and a reduced rated voltage. This shrinks the operational input voltage range for this application. The changes in inductors (IBB and IBK) have an impact on efficiency due to the changes in DCR. The VINLS capacitors are not needed for this scenario due to the capacitance already on the SYS line and low resistance between VINLS pins and SYS nodes, though this can have an impact on very-fast transient load performance.

Unused pins left as No Connect can reduce the routing requirements of the board and make routing out the signals that are needed easily. Less signals with routing out of the IC means that passive components to be pulled in closer. Table 2-1 shows are some signals that can be left open but still allow critical charging and power rail operations:

Table 2-1 No-Connect Signals
Signal Impact of No-Connect Mitigation Actions
GPIO1 Loss of GPIO1 functions
GPIO2 Loss of GPIO2 functions
/CE Charge enabled by default Charge can be disabled via I2C.
/MR Push-button-driven hardware reset and Shipmode Entry / Exit functions lost. HW Reset and Shipmode Entry can be done via I2C. Shipmode Exit can be done via VIN assertion.
/INT Loss of /INT reporting to notify of asynchronous event or fault. Device status and fault registers can be polled for changes in behavior.
ADCIN Loss of ADCIN channel.
TS Loss of TS function. Device detects TS fault by default which prevents charging. TS_ACTION_EN = 0 can be used to enable charging despite detected TS Fault.