SFFS115 March   2021 DRV8889-Q1

 

  1.   Trademarks
  2. 1Overview
  3. 2Functional Safety Failure In Time (FIT) Rates
  4. 3Failure Mode Distribution (FMD)
  5. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 HTSSOP Package
    2. 4.2 QFN Package

Functional Safety Failure In Time (FIT) Rates

This section provides Functional Safety Failure In Time (FIT) rates for DRV8889-Q1 and DRV8889A-Q1 based on two different industry-wide used reliability standards:

  • Table 2-1 provides FIT rates based on IEC TR 62380 / ISO 26262 part 11 for the HTSSOP Package.
  • Table 2-2 provides FIT rates based on IEC TR 62380 / ISO 26262 part 11 for the QFN Package.
  • Table 2-3 provides FIT rates based on the Siemens Norm SN 29500-2.

Table 2-1 Component Failure Rates per IEC TR 62380 / ISO 26262 Part 11 for HTSSOP Package
FIT IEC TR 62380 / ISO 26262FIT (Failures Per 109 Hours)
Total Component FIT Rate23
Die FIT Rate7
Package FIT Rate16
Table 2-2 Component Failure Rates per IEC TR 62380 / ISO 26262 Part 11 for QFN Package
FIT IEC TR 62380 / ISO 26262 FIT (Failures Per 109 Hours)
Total Component FIT Rate

21

Die FIT Rate

9

Package FIT Rate

12

The failure rate and mission profile information in Table 2-1 and Table 2-2 comes from the Reliability data handbook IEC TR 62380 / ISO 26262 part 11:

  • Mission Profile: Motor Control from Table 11
  • Power dissipation: 1 W
  • Climate type: World-wide Table 8
  • Package factor (lambda 3): Table 17b
  • Substrate Material: FR4
  • EOS FIT rate assumed: 0 FIT

Table 2-3 Component Failure Rates per Siemens Norm SN 29500-2
TableCategoryLambda ref FITTheta vj
5CMOS/BICMOS ASICs Analog & Mixed =<50V supply60 FIT70°C

The Reference FIT Rate and Reference Virtual TJ (junction temperature) in Table 2-3 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.