SFFSAD0 April 2025 HDC3120-Q1

2 Functional Safety Failure In Time (FIT) Rates

This section provides functional safety failure in time (FIT) rates for HDC3120-Q1 based on two different industry-wide used reliability standards:

Table 2-1 provides FIT rates based on IEC TR 62380 / ISO 26262 part 11
Table 2-2 provides FIT rates based on the Siemens Norm SN 29500-2

Table 2-1 Component Failure Rates per IEC TR 62380 / ISO 26262 Part 11

FIT IEC TR 62380 / ISO 26262	FIT (Failures Per 10⁹ Hours)
Total component FIT rate	5
Die FIT rate	2
Package FIT rate	3

The failure rate and mission profile information in Table 2-1 comes from the reliability data handbook IEC TR 62380 / ISO 26262 part 11:

Mission profile: Motor control from table 11 or figure 16
Power dissipation: 2.73mW
Climate type: World-wide table 8 or figure 13
Package factor (lambda 3): Table 17b or figure 15
Substrate material: FR4
EOS FIT rate assumed: 0 FIT

Note: Assumes the HDC3120 on-chip heater is enabled for ten minutes daily.

Table 2-2 Component Failure Rates per Siemens Norm SN 29500-2

Table	Category	Reference FIT Rate	Reference Virtual T_J
5	CMOS, BICMOS Digital, analog, or mixed	60 FIT	70°C

The reference FIT rate and reference virtual T_J (junction temperature) in Table 2-2 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.