SFFSAD5 July 2025 TPS7B87-Q1

4 Pin Failure Mode Analysis (Pin FMA)

This section provides a failure mode analysis (FMA) for the pins of the TPS7B87-Q1 (TO-252 and HSOIC packages). The failure modes covered in this document include the typical pin-by-pin failure scenarios:

Pin short-circuited to ground (see Table 4-2 and Table 4-6)
Pin open-circuited (see Table 4-3 and Table 4-7)
Pin short-circuited to an adjacent pin (see Table 4-4 and Table 4-8)
Pin short-circuited to V_IN (see Table 4-5 and Table 4-9)

Table 4-2 through Table 4-9 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.

Table 4-1 TI Classification of Failure Effects

Class	Failure Effects
A	Potential device damage that affects functionality.
B	No device damage, but loss of functionality.
C	No device damage, but performance degradation.
D	No device damage, no impact to functionality or performance.

Following are the assumptions of use and the device configuration assumed for the pin FMA in this section:

Device operates at free-air temperatures between -40°C and 150°C.
Device operates at an input voltage of at least 3V and no more than 40V.
Device operates according to all recommended operating conditions, and the absolute maximum ratings in the device data sheet are not exceeded.
NC pins are floating.